QSD2030 Fairchild Semiconductor, QSD2030 Datasheet - Page 2

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QSD2030

Manufacturer Part Number
QSD2030
Description
Photodiodes T-1 3- 4 SENSOR
Manufacturer
Fairchild Semiconductor
Type
Plastic Silicon PIN Photodioder
Datasheets

Specifications of QSD2030

Lens Type
Clear Epoxy
Photodiode Material
Silicon
Peak Wavelength
880 nm
Half Intensity Angle Degrees
20 deg
Maximum Reverse Voltage
50 V
Maximum Power Dissipation
100 mW
Maximum Light Current
25 uA
Maximum Dark Current
10 nA
Maximum Rise Time
5 ns
Maximum Fall Time
5 ns
Package / Case
T-1 3/4
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Photodiode Type
PIN
Polarity
Forward
Forward Voltage
1.3V
Dark Current (max)
10nA
Power Dissipation
100mW
Light Current
25uA
Rise Time
5ns
Fall Time
5ns
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
2
Package Type
T-1 3/4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Manufacturer
Quantity
Price
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Part Number:
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©2005 Fairchild Semiconductor Corporation
QSD2030 Rev. 1.1.0
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Notes:
1. Derate power dissipation linearly 1.33mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16” (1.6mm) minimum from housing.
Electrical/Optical Characteristics
Symbol
V
I
I
C
PS
SR
t
t
D
L
r
f
F
Symbol
T
T
T
T
SOL-F
V
SOL-I
OPR
P
STG
BR
D
Peak Sensitivity Wavelength
Wavelength Sensitivity Range
Reception Angle
Forward Voltage
Reverse Dark Current
Reverse Light Current
Capacitance
Rise Time
Fall Time
Parameter
Operating Temperature
Storage Temperature
Soldering Temperature (Iron)
Soldering Temperature (Flow)
Reverse Breakdown Voltage
Power Dissipation
(T
A
= 25°C unless otherwise specified)
(1)
Parameter
I
V
Ee = 0.5mW/cm
V
V
(T
F
R
R
R
= 950nm
A
= 80mA
= 10V, Ee = 0
= 0, f = 1MHz, Ee = 0
= 5V, R
=25°C)
Test Conditions
(2,3,4)
(2,3)
L
2
= 50 ,
2
, V
R
= 950nm
= 5V,
260 for 10 sec
Min.
240 for 5 sec
400
-40 to +100
-40 to +100
15
Rating
100
50
Typ.
±20
880
1.3
25
60
5
5
Max.
1100
10
www.fairchildsemi.com
Unit
mW
°C
°C
°C
°C
V
Units
nm
nm
nA
µA
pF
ns
V
°

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