LPC1768FBD100 NXP Semiconductors, LPC1768FBD100 Datasheet - Page 43

• Manufacturer Part Number: LPC1768FBD100
• Description: IC, 32BIT MCU ARM CORTEX 100MHZ LQFP-100
• Manufacturer: NXP Semiconductors

Specifications of LPC1768FBD100

• Controller Family/series: (ARM Cortex)
• No. Of I/o's: 70
• Ram Memory Size: 64KB
• Cpu Speed: 100MHz
• No. Of Timers: 4
• Interface: CAN, I2C, SPI, UART
• Core Size: 32 Bit
• Program Memory Size: 512KB
• Oscillator Type: External, Internal
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
9. Thermal characteristics
Table 6.
V
LPC1769_68_67_66_65_64_63
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
−
=
T
R
P
40
amb
D
T
th(j-a)
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
+
= the package junction-to-ambient thermal resistance (°C/W)
(
P
D
All information provided in this document is subject to legal disclaimers.
°
Conditions
×
C unless otherwise specified;
R
th j a
(
Rev. 6.01 — 11 March 2011
–
)
)
LPC1769/68/67/66/65/64/63
j
(°C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
°C
43 of 79
(1)