LPC1758FBD80 NXP Semiconductors, LPC1758FBD80 Datasheet - Page 38

• Manufacturer Part Number: LPC1758FBD80
• Description: IC, 32BIT MCU, ARM CORTEX, 100MHZ LQFP80
• Manufacturer: NXP Semiconductors

Specifications of LPC1758FBD80

• Controller Family/series: (ARM Cortex)
• No. Of I/o's: 52
• Ram Memory Size: 64KB
• Cpu Speed: 100MHz
• No. Of Timers: 4
• Interface: CAN, I2C, SPI, UART
• Core Size: 32 Bit
• Program Memory Size: 512KB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
9. Thermal characteristics
Table 5.
V
LPC1758_56_54_52_51_3
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
•
•
•
−
=
T
R
P
40
amb
D
th(j-a)
T
amb
°
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (°C),
= the package junction-to-ambient thermal resistance (°C/W)
+
(
P
D
°
Conditions
×
C unless otherwise specified;
R
th j a
Rev. 03 — 19 November 2009
(
–
)
)
J
(°C), can be calculated using the following
LPC1758/56/54/52/51
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2009. All rights reserved.
Unit
°C
38 of 64
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