EA-EDU-009 Embedded Artists, EA-EDU-009 Datasheet - Page 33

MCU, MPU & DSP Development Tools LPC2103 EDUCATION BRD

EA-EDU-009

Manufacturer Part Number
EA-EDU-009
Description
MCU, MPU & DSP Development Tools LPC2103 EDUCATION BRD
Manufacturer
Embedded Artists
Datasheets

Specifications of EA-EDU-009

Processor To Be Evaluated
LPC2103
Data Bus Width
16 bit, 32 bit
Interface Type
I2C, SPI, UART
Core
ARM7TDMI-S
Dimensions
68 mm x 42 mm
Maximum Operating Temperature
+ 85 C
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
NXP Semiconductors
Fig 12. Package outline SOT778-3 (HVQFN48)
LPC2101_02_03_4
Product data sheet
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
UNIT
mm
SOT778-3
VERSION
OUTLINE
terminal 1
index area
terminal 1
index area
max
A
1
(1)
E
L
0.05
0.00
h
A
12
1
1
e
0.25
0.15
13
b
48
IEC
- - -
0.2
c
D
6.1
5.9
(1)
D
e
D
1
h
JEDEC
3.95
3.65
D
1/2 e
- - -
h
REFERENCES
E
6.1
5.9
b
(1)
Rev. 04 — 2 June 2009
37
3.95
3.65
0
24
E
h
JEITA
25
36
- - -
B
0.4
1/2 e
e
w
v
E
A
M
M
e
4.4
e
C
C
e
scale
1
2
2.5
A
B
4.4
e
2
Single-chip 16-bit/32-bit microcontrollers
A
0.5
0.3
L
A
1
5 mm
0.1
y
v
1
C
PROJECTION
LPC2101/02/03
EUROPEAN
0.05
w
detail X
0.05
y
C
X
0.1
y
y
1
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
04-06-16
04-06-23
c
SOT778-3
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