FDMC8554 Fairchild Semiconductor, FDMC8554 Datasheet

FDMC8554

Manufacturer Part Number

FDMC8554

Description

MOSFET N-CH 20V 16.5A POWER33

Manufacturer

Fairchild Semiconductor

Series

PowerTrench®r

Datasheet

1.FDMC8554.pdf (7 pages)

Specifications of FDMC8554

Fet Type

MOSFET N-Channel, Metal Oxide

Fet Feature

Logic Level Gate

Rds On (max) @ Id, Vgs

5 mOhm @ 16.5A, 10V

Drain To Source Voltage (vdss)

20V

Current - Continuous Drain (id) @ 25° C

16.5A

Vgs(th) (max) @ Id

3V @ 250µA

Gate Charge (qg) @ Vgs

62nC @ 10V

Input Capacitance (ciss) @ Vds

3380pF @ 10V

Power - Max

Mounting Type

Surface Mount

Package / Case

8-MLP, Power33

Configuration

Single Quad Drain Triple Source

Transistor Polarity

N-Channel

Resistance Drain-source Rds (on)

0.005 Ohm @ 10 V

Forward Transconductance Gfs (max / Min)

62 S

Drain-source Breakdown Voltage

20 V

Gate-source Breakdown Voltage

+/- 20 V

Continuous Drain Current

16.5 A

Power Dissipation

2000 mW

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 55 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

FDMC8554TR

Available stocks

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Part Number

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Price

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Part Number:

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Manufacturer:

FAIRCHILD

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This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence. This is a preliminary

notification. A Final PCN will be issued when qualification is complete and data is available.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

If you have any questions concerning this change, please contact:

PCN Originator:

Name: Lam, HH

E-mail: HH.Lam@fairchildsemi.com

Phone: 604 850 2392

Implementation of change:

Expected 1st Device Shipment Date: 2008/02/10

Earliest Year/Work Week of Changed Product: 0812

Change Type Description: Mold Compound

Description of Change (From): FPG 8L MLP3x3 package assembly at all FSC approved

manufacturing location(s) (Carsem) using non Green mold compound as shown in table 1.

Description of Change (To): FPG 8L MLP 3x3 package assembly at all FSC approved

manufacturing location(s) (Carsem) using Green mold compound as shown in table 2.

Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is

dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level

interconnect lead-free and RoHS compliance. The referenced material changes have been made

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070296

Qualification :

Qualification of Carsem FPG 8L MLP 3x3 with Green EMC (G600)

Change From

Technical Contact:

Name: Yeoh, LiangChoon

E-mail: Liang.Yeoh@fairchildsemi.com

Phone: 604 850 2744

FORECAST CHANGE NOTIFICATION

Date Issued On : 2007/11/30

Date Created : 2007/11/12

PCN# : Q4074601

Pg. 1

Related parts for FDMC8554

FDMC8554 Summary of contents

Page 1

... This notification is for your information and concurrence. This is a preliminary notification. A Final PCN will be issued when qualification is complete and data is available. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. If you have any questions concerning this change, please contact: ...

Page 2

Change To Qualification Stress Test and Sample Size Detail Device #1 FDM6296 Package: #Leads: Precondition Description: Stress P/C Standard PCNL1A JESD22-A113 Environment Stress Detail: Stress P/C Standard HAST2 X JESD22-A110 85%RH, 110C, PRCL MIL- STD-750-1036 TMCL1 X JESD22-A104 -65C, 150C ...

Page 3

... Readpoints Conditions TP1 TP2 264 24V 168 500 168 500 Delta 100CC, 2 5000 10000 Min cycle 100 500 FDM3300NZ_NL FDM6296 FDMC2610 FDMC5614P FDMC8878 A 0 Samples TP3 1000 77 1000 Read- Sample points A 0 Samples TP3 1000 77 1000 FDM3622 FDM6296_NL FDMC2674 FDMC8554 FDMC8878_NBSE003 Pg. 3 ...

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