BSS138 Fairchild Semiconductor, BSS138 Datasheet - Page 2

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BSS138

Manufacturer Part Number
BSS138
Description
MOSFET N-CH 50V 220MA SOT-23
Manufacturer
Fairchild Semiconductor
Type
Power MOSFETr
Datasheet

Specifications of BSS138

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
3.5 Ohm @ 220mA, 10V
Drain To Source Voltage (vdss)
50V
Current - Continuous Drain (id) @ 25° C
220mA
Vgs(th) (max) @ Id
1.5V @ 1mA
Gate Charge (qg) @ Vgs
2.4nC @ 10V
Input Capacitance (ciss) @ Vds
27pF @ 25V
Power - Max
360mW
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
3.5Ohm
Drain-source On-volt
50V
Gate-source Voltage (max)
±20V
Drain Current (max)
220mA
Power Dissipation
360mW
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Package Type
SOT-23
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
3.5 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
0.5 S
Drain-source Breakdown Voltage
50 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.22 A
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Continuous Drain Current Id
220mA
Drain Source Voltage Vds
50V
On Resistance Rds(on)
3.5ohm
Rds(on) Test Voltage Vgs
10V
Power Dissipation Pd
360mW
No. Of Pins
3
Gate-source Voltage
20V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BSS138TR

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Notes:
1.
Scale 1 : 1 on letter size paper
2.
Electrical Characteristics
Symbol
Off Characteristics
BV
I
I
On Characteristics
V
R
I
g
Dynamic Characteristics
C
C
C
Switching Characteristics
t
t
t
t
Q
Q
Q
Drain–Source Diode Characteristics and Maximum Ratings
I
V
R
f
DSS
GSS
D(on)
d(on)
r
d(off)
S
BV
V
FS
GS(th)
SD
DS(on)
iss
oss
rss
g
gs
gd
R
the drain pins. R
Pulse Test: Pulse Width
G
GS(th)
DSS
T
T
JA
DSS
J
J
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage.
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
JC
is guaranteed by design while R
a) 350°C/W when mounted on a
minimum pad..
300 s, Duty Cycle
Parameter
(Note 2)
(Note 2)
2.0%
CA
is determined by the user's board design.
V
I
V
V
V
V
V
I
V
V
V
V
V
V
f = 1.0 MHz
V
V
V
V
V
V
T
D
D
A
GS
DS
DS
DS
GS
DS
GS
GS
GS
GS
DS
DS
GS
DD
GS
DS
GS
GS
= 250 A,Referenced to 25 C
= 1 mA,Referenced to 25 C
= 25°C unless otherwise noted
= 10 V, I
= 50 V,
= 50 V, V
= 30 V,
= V
= 10V,
= 25 V,
= 25 V,
= 0 V,
= 20 V,
= 10 V,
= 4.5 V,
= 10 V,
= 15 mV, f = 1.0 MHz
= 30 V,
= 10 V,
= 10 V
= 0 V,
Test Conditions
GS
,
D
GS
= 0.22 A, T
V
V
V
= 0 V T
I
I
I
I
V
I
V
I
R
I
I
GS
GS
DS
D
D
D
D
D
D
D
S
DS
GEN
GS
= 250 A
= 1 mA
= 0.22 A
= 0.22 A
= 0.22 A
= 0.29 A,
= 0.22 A,
= 0.44 A
= 0 V
= 0 V
= 0 V
= 5 V
= 0 V,
= 6
J
= 125 C
J
= 125 C
(Note 2)
Min Typ Max Units
0.12
0.8
0.2
50
1.3
0.7
1.0
1.1
0.5
2.5
1.7
0.1
0.4
0.8
72
–2
27
13
20
6
9
9
7
0.22
100
0.5
1.5
3.5
6.0
5.8
2.4
1.4
100
18
36
14
5
5
BSS138 Rev C(W)
mV/ C
mV/ C
V
nC
nC
nC
nA
nA
pF
pF
pF
ns
ns
ns
ns
V
A
S
A
V
A
A

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