MT45W2MW16BGB-701 IT Micron Technology Inc, MT45W2MW16BGB-701 IT Datasheet - Page 21

• Manufacturer Part Number: MT45W2MW16BGB-701 IT
• Manufacturer: Micron Technology Inc

Specifications of MT45W2MW16BGB-701 IT

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Figure 14:
PDF: 09005aef82832fa2/Source: 09005aef82832f5f
32mb_burst_cr1_0_p24z_2.fm - Rev. E 9/08 EN
(except A19)
DQ[15:0]
LB#/UB#
A[20:0]
ADV#
WAIT
A19
CE#
WE#
OE#
CLK
CRE
2
3
Synchronous Mode Configuration Register WRITE Followed by READ ARRAY Operation
Latch control register value
High-Z
Notes:
t CEW
t CSP
OPCODE
t SP
t SP
t SP
t SP
1. Nondefault BCR settings for CR WRITE in synchronous mode followed by READ ARRAY
2. A[19] = LOW to load RCR, HIGH to load BCR.
3. CE# must remain LOW to complete a burst-of-one WRITE. WAIT must be monitored—addi-
t HD
t HD
t HD
t HD
operation: latency code 2 (3 clocks); WAIT active LOW; WAIT asserted during delay.
tional WAIT cycles caused by refresh collisions require a corresponding number of addi-
tional CE# LOW cycles.
32Mb: 2 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
Latch control register address
21
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t CBPH
High-Z
Address
Address
Configuration Registers
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Valid
data