MT45W2MW16BGB-701 IT Micron Technology Inc, MT45W2MW16BGB-701 IT Datasheet - Page 60

• Manufacturer Part Number: MT45W2MW16BGB-701 IT
• Manufacturer: Micron Technology Inc

Specifications of MT45W2MW16BGB-701 IT

• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Compliant

Package Dimensions
Figure 49:
and temperature range for production devices. Although considered final, these specifications are subject to change, as fur-
PDF: 09005aef82832fa2/Source: 09005aef82832f5f
32mb_burst_cr1_0_p24z_2.fm - Rev. E 9/08 EN
their respective owners. This data sheet contains minimum and maximum limits specified over the complete power supply
Technology, Inc., inside the U.S. and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. CellularRAM is a trademark of Micron
Seating
Dimensions apply
to solder balls
post-reflow.
Pre-reflow ball
diameter is 0.35
on a 0.30 SMD
ball pad.
plane
6.00
0.10 A
54X Ø0.37
Ball A6
3.00
54-Ball VFBGA
A
Notes:
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
ther product development and data characterization sometimes occur.
1.875
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W2MW16BGB uses “green” packaging.
6.00 ±0.10
0.25mm per side.
0.75
TYP
3.75
32Mb: 2 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
3.00 ±0.05
0.75 TYP
Ball A1
Ball A1 ID
0.70 ±0.05
4.00 ±0.05
60
®
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID