PCA2002U/10AB/1,00 NXP Semiconductors, PCA2002U/10AB/1,00 Datasheet - Page 15

• Manufacturer Part Number: PCA2002U/10AB/1,00
• Manufacturer: NXP Semiconductors

Specifications of PCA2002U/10AB/1,00

• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
11. Bare die outline
Fig 10. Bare die outline PCA200xU
PCA2002_6
Product data sheet
Wire bond die; 8 bonding pads; 1.16 x 0.86 x 0.22 mm
DIMENSIONS (mm are the original dimensions)
mm
PCA200xU
UNIT
VERSION
OUTLINE
max
nom
min
0.22
0.20
0.18
A
1.16
D
IEC
0.86
E
0.17
e
D
e
D
1
32 kHz watch circuit with programmable output period and pulse width
0.32
e
JEDEC
2
All information provided in this document is subject to legal disclaimers.
0.96
REFERENCES
e
D
X
0.099
0.096
0.093
Rev. 06 — 6 May 2010
P
e
1
1
e
0.089
0.086
0.083
JEITA
2
P
2
E
0.099
0.096
0.093
P
3
0.089
0.086
0.083
P
4
A
0
PROJECTION
EUROPEAN
scale
0.5
detail X
P
P
1
2
PCA2002
© NXP B.V. 2010. All rights reserved.
P
ISSUE DATE
1 mm
4
08-05-09
08-05-21
P
PCA200xU
3
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