PCA2002U/10AB/1,00 NXP Semiconductors, PCA2002U/10AB/1,00 Datasheet - Page 2

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PCA2002U/10AB/1,00

Manufacturer Part Number
PCA2002U/10AB/1,00
Description
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PCA2002U/10AB/1,00

Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
4. Ordering information
Table 1.
5. Block diagram
PCA2002_6
Product data sheet
Type number
PCA2002U/AB/1
PCA2002U/10AB/1 PCA200xU
PCA2002CX8/5/1
Ordering information
Package
Name
PCA200xU
PCA200xCX wafer level chip-size package;
Fig 1.
OSCOUT
V
V
OSCIN
DD
SS
Block diagram
Description
wire bond die; 8 bonding pads;
1.16 × 0.86 × 0.22 mm
wire bond die; 8 bonding pads;
1.16 × 0.86 × 0.22 mm
8 bumps; 1.16 × 0.86 × 0.31 mm
32 kHz watch circuit with programmable output period and pulse width
All information provided in this document is subject to legal disclaimers.
OSCILLATOR
VOLTAGE DETECTOR,
OTP-CONTROLLER
n.c.
PCA2002
Rev. 06 — 6 May 2010
n.c.
÷ 4
TIMING ADJUSTMENT,
INHIBITION
Delivery form
bare die; chip in tray
bare die; chip on film frame carrier
unsawn wafer with lead free solder
bumps
OTP-MEMORY
8 kHz
32 Hz
DIVIDER
MOTOR CONTROL
MOT1
M
1 Hz
RESET
reset
MOT2
PCA2002
© NXP B.V. 2010. All rights reserved.
Version
PCA200xU
PCA200xU
PCA200xCX
mbl568
RESET
i.c.
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