PCA2002U/10AB/1,00 NXP Semiconductors, PCA2002U/10AB/1,00 Datasheet - Page 22

• Manufacturer Part Number: PCA2002U/10AB/1,00
• Manufacturer: NXP Semiconductors

Specifications of PCA2002U/10AB/1,00

• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
14. Abbreviations
15. References
PCA2002_6
Product data sheet
13.3.4 Cleaning
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
Cleaning can be done after reflow soldering.
Table 14.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
Acronym
HBM
LSB
MM
MSB
OTP
AN10706 — Handling bare die
IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
JESD78 — IC Latch-Up Test
JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
NX3-00092 — NXP store and transport requirements
Abbreviations
32 kHz watch circuit with programmable output period and pulse width
All information provided in this document is subject to legal disclaimers.
Description
Human Body Model
Least Significant Bit
Machine Model
Most Significant Bit
One Time Programmable
Rev. 06 — 6 May 2010
PCA2002
© NXP B.V. 2010. All rights reserved.
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