PCA2002U/10AB/1,00 NXP Semiconductors, PCA2002U/10AB/1,00 Datasheet - Page 19

• Manufacturer Part Number: PCA2002U/10AB/1,00
• Manufacturer: NXP Semiconductors

Specifications of PCA2002U/10AB/1,00

• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
PCA2002_6
Product data sheet
12.2 Unsawn wafer information
Fig 14. Wafer layout of PCA2002CX8
The die are grouped in arrays of 2 × 6 devices. Each array is edged with a metal path. All this metal
paths have to be cut while dicing.
32 kHz watch circuit with programmable output period and pulse width
All information provided in this document is subject to legal disclaimers.
84 μm
Y
Rev. 06 — 6 May 2010
Saw lane
detail Y
1
4
1
4
1
4
1
4
1
4
1
4
~18 μm
Straight edge of the wafer
84 μm
(1)
8
5
8
5
8
5
8
5
8
5
8
5
X
1
4
1
4
1
4
1
4
1
4
1
4
Saw lane
detail X
~18 μm
84 μm
(1)
8
5
8
5
8
5
8
5
8
5
8
5
001aai236
~18 μm
(1)
(1)
PCA2002
© NXP B.V. 2010. All rights reserved.
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