K4S643232H-TI70 Samsung Semiconductor, K4S643232H-TI70 Datasheet - Page 18

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K4S643232H-TI70

Manufacturer Part Number
K4S643232H-TI70
Description
Manufacturer
Samsung Semiconductor
Datasheet

Specifications of K4S643232H-TI70

Lead Free Status / Rohs Status
Not Compliant
Device Operation &
Timing Diagram
BASIC FEATURE AND FUNCTION DESCRIPTIONS
1. CLOCK Suspend
2. DQM Operation
*Note : 1. CKE to CLK disable/enable = 1CLK.
DQ(CL2)
DQ(CL3)
DQ(CL2)
DQ(CL3)
DQ(CL2)
DQ(CL3)
3) DQM with Clock Suspended (Full Page Read)
Internal
CMD
DQM
DQM
CMD
CMD
CKE
CKE
CKE
CLK
2. DQM makes data out Hi-Z after 2CLKs which should masked by CKE " L"
3. DQM masks both data-in and data-out.
CLK
CLK
1) Clock Suspended During Write (BL=4
1) Write Mask (BL=4)
RD
WR
WR
D
D
D
D
0
0
0
0
D
D
D
D
1
1
1
1
DQM to Data-in Mask = 0
Q
Not Written
0
Masked by CKE
Masked byDQM
D
D
D
D
2
2
3
3
Hi-Z
Hi-Z
D
D
Note 2
3
3
Q
Q
2
1
- 18
2) Clock Suspended During Read (BL=4)
Hi-Z
Hi-Z
2) Read Mask (BL=4)
RD
RD
Q
Q
4
3
Hi-Z
Hi-Z
Q
Q
0
0
Hi-Z
Hi-Z
D
Q
Q
0
Q
Q
1
0
Masked by DQM
6
5
Q
Q
Suspended Dout
Q
Q
Masked by CKE
2
1
DQM to Data-out Mask = 2
Q
Q
7
6
Rev. 1.2 April 2006
2
1
Q
Q
Q
Q
3
2
8
7
Q
Q
Q
x32 SDRAM
3
2
3
Q
3

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