LFXP3E-3QN208I Lattice, LFXP3E-3QN208I Datasheet - Page 385

• Manufacturer Part Number: LFXP3E-3QN208I
• Description: IC FPGA 3.1KLUTS 136I/O 208-PQFP
• Manufacturer: Lattice

Specifications of LFXP3E-3QN208I

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Lattice Semiconductor
144-ball csBGA BGA Breakout Examples
These examples place an ispMACH 4000ZE in a 7x7 mm, 0.5 mm pitch, 144-ball csBGA package (LC4256ZE-
MN144) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O utilization and a 4-layer with
about 5% fewer I/Os. The 6-layer (Example #1) design avoids uses of micro vias and takes advantage of removed
pads on inner layers to route all pins out to 6 layers with good layer structure for high-speed signal integrity.
Figure 14-8. CAM Artwork Screen Shots, Example #1, 144-ball csBGA
Layer 1 Primary
Layer 3 Signal
Layer 5 Power
14-10
Layer 6 Secondary
PCB Layout Recommendations
Layer 4 Signal
Layer 2 GND
for BGA Packages