P89LPC931FDH NXP Semiconductors, P89LPC931FDH Datasheet - Page 16

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P89LPC931FDH

Manufacturer Part Number
P89LPC931FDH
Description
MCU 8-Bit 89LP 80C51 CISC 8KB Flash 2.5V/3.3V 28-Pin TSSOP Tube
Manufacturer
NXP Semiconductors
Datasheet

Specifications of P89LPC931FDH

Package
28TSSOP
Device Core
80C51
Family Name
89LP
Maximum Speed
18 MHz
Ram Size
256 Byte
Program Memory Size
8 KB
Operating Supply Voltage
2.5|3.3 V
Data Bus Width
8 Bit
Program Memory Type
Flash
Number Of Programmable I/os
26
Interface Type
I2C/SPI/UART
Operating Temperature
-40 to 85 °C
Number Of Timers
2

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Philips Semiconductors
8. Functional description
9397 750 14472
Product data
8.2.1 Clock definitions
8.2.2 CPU clock (OSCCLK)
8.2.3 Low speed oscillator option
8.2.4 Medium speed oscillator option
8.2.5 High speed oscillator option
8.1 Enhanced CPU
8.2 Clocks
Remark: Please refer to the P89LPC930/931 User’s Manual for a more detailed
functional description.
The P89LPC930/931 uses an enhanced 80C51 CPU which runs at 6 times the speed
of standard 80C51 devices. A machine cycle consists of two CPU clock cycles, and
most instructions execute in one or two machine cycles.
The P89LPC930/931 device has several internal clocks as defined below:
OSCCLK — Input to the DIVM clock divider. OSCCLK is selected from one of four
clock sources (see
(see
Note: f
CCLK — CPU clock; output of the clock divider. There are two CCLK cycles per
machine cycle, and most instructions are executed in one to two machine cycles (two
or four CCLK cycles).
RCCLK — The internal 7.373 MHz RC oscillator output.
PCLK — Clock for the various peripheral devices and is CCLK/2
The P89LPC930/931 provides several user-selectable oscillator options in generating
the CPU clock. This allows optimization for a range of needs from high precision to
lowest possible cost. These options are configured when the FLASH is programmed
and include an on-chip Watchdog oscillator, an on-chip RC oscillator, an oscillator
using an external crystal, or an external clock source. The crystal oscillator can be
optimized for low, medium, or high frequency crystals covering a range from 20 kHz
to 12 MHz.
This option supports an external crystal in the range of 20 kHz to 100 kHz. Ceramic
resonators are also supported in this configuration.
This option supports an external crystal in the range of 100 kHz to 4 MHz. Ceramic
resonators are also supported in this configuration.
This option supports an external crystal in the range of 4 MHz to 18 MHz. Ceramic
resonators are also supported in this configuration. When using an oscillator
frequency above 12 MHz, the reset input function of P1.5 must be enabled. An
external circuit is required to hold the device in reset at power-up until V
reached its specified level. When system power is removed V
Section 8.7 “CPU CLOCK (CCLK) modification: DIVM
osc
is defined as the OSCCLK frequency.
Rev. 05 — 15 December 2004
Figure
4) and can also be optionally divided to a slower frequency
8-bit microcontrollers with two-clock 80C51 core
P89LPC930/931
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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