P89LPC931FDH NXP Semiconductors, P89LPC931FDH Datasheet - Page 3
P89LPC931FDH
Manufacturer Part Number
P89LPC931FDH
Description
MCU 8-Bit 89LP 80C51 CISC 8KB Flash 2.5V/3.3V 28-Pin TSSOP Tube
Manufacturer
NXP Semiconductors
Datasheet
1.P89LPC931FDH.pdf
(55 pages)
Specifications of P89LPC931FDH
Package
28TSSOP
Device Core
80C51
Family Name
89LP
Maximum Speed
18 MHz
Ram Size
256 Byte
Program Memory Size
8 KB
Operating Supply Voltage
2.5|3.3 V
Data Bus Width
8 Bit
Program Memory Type
Flash
Number Of Programmable I/os
26
Interface Type
I2C/SPI/UART
Operating Temperature
-40 to 85 °C
Number Of Timers
2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
P89LPC931FDH
Manufacturer:
SAMSUNG
Quantity:
10 122
Part Number:
P89LPC931FDH
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Company:
Part Number:
P89LPC931FDHЈ¬112
Manufacturer:
PH3
Quantity:
1 995
Philips Semiconductors
3. Ordering information
9397 750 14472
Product data
3.1 Ordering options
Table 1:
Table 2:
Type number
P89LPC930FDH
P89LPC931FDH
Type number
P89LPC930FDH
P89LPC931FDH
Ordering information
Part options
Rev. 05 — 15 December 2004
Package
Name
TSSOP28
TSSOP28
Program memory
4 kB
8 kB
Description
plastic thin shrink small outline package;
28 leads; body width 4.4 mm
plastic thin shrink small outline package;
28 leads; body width 4.4 mm
8-bit microcontrollers with two-clock 80C51 core
Temperature range
45 C to +85 C
45 C to +85 C
P89LPC930/931
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Frequency
0 MHz to 18 MHz
0 MHz to 18 MHz
Version
SOT361-1
SOT361-1
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