STM32F103T8

Manufacturer Part NumberSTM32F103T8
DescriptionMainstream Performance line, ARM Cortex-M3 MCU with 64 Kbytes Flash, 72 MHz CPU, motor control, USB and CAN
ManufacturerSTMicroelectronics
STM32F103T8 datasheet
 

Specifications of STM32F103T8

Conversion Range0 to 3.6 VPeripherals Supportedtimers, ADC, SPIs, I2Cs and USARTs
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Package characteristics
6.2
Thermal characteristics
The maximum chip junction temperature (T
Table 9: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
max is the maximum ambient temperature in °C,
T
A
Θ
is the package junction-to-ambient thermal resistance, in °C/W,
JA
P
max is the sum of P
D
P
max is the product of I
INT
internal power.
P
max represents the maximum power dissipation on output pins where:
I/O
max = Σ (V
P
I/O
taking into account the actual V
application.
Table 58.
Package thermal characteristics
Symbol
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
Θ
JA
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 48 -7 × 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 × 6 mm / 0.5 mm pitch
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
88/99
max) must never exceed the values given in
J
36.
max, in degrees Celsius, may be calculated
J
T
max = T
max + (P
J
A
max and P
max (P
INT
I/O
and V
, expressed in Watts. This is the maximum chip
DD
DD
) + Σ((V
× I
– V
) × I
OL
OL
DD
OH
OH
/ I
and V
/ I
OL
OL
OH
Parameter
Doc ID 13587 Rev 13
STM32F103x8, STM32F103xB
max × Θ
)
D
JA
max = P
max + P
max),
D
INT
I/O
),
of the I/Os at low and high level in the
OH
Value
44
46
45
65
55
16
18
Unit
°C/W