adsp-21469 Analog Devices, Inc., adsp-21469 Datasheet - Page 51

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adsp-21469

Manufacturer Part Number
adsp-21469
Description
Sharc Processor
Manufacturer
Analog Devices, Inc.
Datasheet

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Preliminary Technical Data
THERMAL CHARACTERISTICS
The ADSP-21469 processor is rated for performance over the
temperature range specified in
Page
Table 47
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board design complies with
JEDEC standards JESD51-7 (PBGA). The junction-to-case mea-
surement complies with MIL- STD-883. All measurements use a
2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use:
where:
T
T
package
is the Typical value from
P
Values of
design considerations.
mation of T
where:
T
Values of
design considerations when an external heatsink is required.
D
J
CASE
A
JT
= junction temperature C
= power dissipation
= ambient temperature C
= junction-to-top (of package) characterization parameter
16.
12
10
= case temperature ( C) measured at the top center of the
Figure 44. Typical Output Delay or Hold vs. Load Capacitance
8
6
4
2
0
0
airflow measurements comply with JEDEC standards
JA
JC
J
by the equation:
are provided for package comparison and PCB
are provided for package comparison and PCB
50
T
J
T
(at Ambient Temperature)
=
J
=
JA
T
Table
TBD
CASE
can be used for a first order approxi-
100
T
A
+
Operating Conditions on
47.
+
JA
150
JT
P
D
P
D
200
Rev. PrB | Page 51 of 56 | November 2008
250
Values of
design considerations. Note that the thermal characteristics val-
ues provided in
Table 47. Thermal Characteristics for 324-Lead PBGA
Parameter
JA
JMA
JMA
JC
JT
JMT
JMT
JB
are provided for package comparison and PCB
Table 47
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
ADSP-21469/ADSP-21469W
are modeled values.
Typical
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W

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