mc68hc705c4acfn Freescale Semiconductor, Inc, mc68hc705c4acfn Datasheet - Page 186

• Manufacturer Part Number: mc68hc705c4acfn
• Description: M68hc05 Microcontrollers
• Manufacturer: Freescale Semiconductor, Inc

Mechanical Specifications
14.3 40-Pin Plastic Dual In-Line Package (PDIP)
14.4 42-Pin Shrink Dual In-Line Package (SDIP)
Technical Data
186
SEATING
PLANE
-T-
1
40
x x x
x x
x x
x
x x
x
x
H
42
1
Figure 14-1. MC68HC705C4AP Package Dimensions (Case #711)
Figure 14-2. MC68HC705C4AB Package Dimensions (Case #858)
D
F
42 PL
0.25 (0.010)
x x x x x x
x x x x
x x x x
x x
x x x x
x x
x x
G
-A-
M
A
G
T A
F
S
22
21
N
D
Mechanical Specifications
C
-B-
K
21
20
J
42 PL
SEATING
PLANE
0.25 (0.010)
N
K
B
C
H
M
x x
x x x x
x x x x
x x
x x x x
x x x x
x
MC68HC705C4A • MC68HSC705C4A — Rev. 3.0
L
T B
M
M
S
L
J
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
G
M
A
B
C
D
F
H
J
K
L
N
DIM
G
M
1.435
0.540
0.155
0.014
0.032
0.008
0.020
A
B
C
D
F
H
K
L
N
0.115
J
MIN
0.070 BSC
0.300 BSC
0.600 BSC
0
INCHES
NOTES:
51.69
13.72
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
1.POSITION TOLERANCE OF LEADS (D), SHA
2.DIMENSION L TO CENTER OF LEADS WHE
3.DIMENSION B DOES NOT INCLUDE MOLD
MILLIMETERS
0
1.465
0.560
0.200
0.022
0.046
0.015
0.135
0.040
MAX
BEWITHIN 0.25 (0.010) AT MAXIMUM MATE
CONDITIONS, IN RELATION TO SEATING P
AND EACH OTHER.
FORMED PARALLEL.
15.24 BSC
15
2.54 BSC
52.45
14.22
MAX
5.08
0.56
1.52
2.16
0.38
3.43
1.02
36.45
13.72
MILLIMETERS
1
3.94
0.36
0.81
0.20
2.92
0.51
MIN
1.778 BSC
15.24 BSC
0
7.62 BSC
37.21
14.22
2.035
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
MAX
5.08
0.56
1.17
0.38
3.43
1.02
MIN
15
MOTOROLA
0
0.600 BSC
0.100 BSC
INCHES
2.065
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
MAX
1