w83637hg Winbond Electronics Corp America, w83637hg Datasheet - Page 127

• Manufacturer Part Number: w83637hg
• Description: Winbond Lpc I/o Lpc I/o
• Manufacturer: Winbond Electronics Corp America

CRF0 (Default 0x00)
CRF1 (Default 0x00)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit 7
Bit 6 - 5 : Devices' trap status.
Bit 4
Bit 3 - 0 : Devices' trap status.
: CHIPPME. Chip level auto power management enable.
= 0
= 1
: CIRPME. Consumer IR port auto power management enable.
= 0
= 1
: MIDIPME. MIDI port auto power management enable.
= 0
= 1
: Reserved. Return zero when read.
: PRTPME. Printer port auto power management enable.
= 0
= 1
: FDCPME. FDC auto power management enable.
= 0
= 1
: URAPME. UART A auto power management enable.
= 0
= 1
: URBPME. UART B auto power management enable.
= 0
= 1
: WAK_STS. This bit is set when the chip is in the sleeping state and an enabled resume
event occurs. Upon setting this bit, the sleeping/working state machine will transition the
system to the working state. This bit is only set by hardware and is cleared by writing a 1
to this bit position or by the sleeping/working state machine automatically when the global
standby timer expires.
= 0
= 1
: Reserved. Return zero when read.
Disable the auto power management functions
Enable the auto power management functions.
Disable the auto power management functions
Enable the auto power management functions.
Disable the auto power management functions
Enable the auto power management functions.
Disable the auto power management functions.
Enable the auto power management functions.
Disable the auto power management functions.
Enable the auto power management functions.
Disable the auto power management functions.
enable the auto power management functions.
Disable the auto power management functions.
Enable the auto power management functions.
The chip is in the sleeping state.
The chip is in the working state.
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Publication Release Date: March, 2006
W83637HF/HG
Revision 1.6