w83637hg Winbond Electronics Corp America, w83637hg Datasheet - Page 131

• Manufacturer Part Number: w83637hg
• Description: Winbond Lpc I/o Lpc I/o
• Manufacturer: Winbond Electronics Corp America

CRF9 (Default 0x00)
CRFE, FF (Default 0x00)
Reserved for Winbond test
8.5 Logical Device B (Hardware Monitor)
CR30 (Default 0x00)
CR60, CR 61 (Default 0x00, 0x00)
These two registers select Hardware Monitor base address [0x100:0xFFF] on 8-byte boundary.
CR70 (Default 0x00)
8.6 Logical Device C (Smart Card interface)
CR30 (Default 0x00)
CR60, CR61 (Default 0x00, 0x00)
These two registers select Smart Card interface base address [0x100:0xFFF] on 8-byte boundary.
Bit 7 - 3 : Reserved. Return zero when read.
Bit 2
Bit 1
Bit 0
Bit 7 - 1 : Reserved.
Bit 0
Bit 7 - 4 : Reserved.
Bit 3 - 0 : These bits select IRQ channel for Hardware Monitor.
Bit 7 - 1 : Reserved.
Bit 0
: PME_EN: Select the power management events to be either an PME or SMI
interrupt for the IRQ events. Note that: this bit is valid only when SMIPME_OE = 1.
= 0
= 1
: FSLEEP: This bit selects the fast expiry time of individual devices.
= 0
= 1
: SMIPME_OE: This is the SMI and PME output enable bit.
= 0
= 1
= 1 Activates the logical device.
= 0 Logical device is inactive.
: Logical device active bit.
= 0 Logical device is inactive.
= 1 Activates the logical device.
The power management events will generate an SMI event
The power management events will generate an PME event.
1 second.
8 milli-seconds
Neither SMI nor PME will be generated. Only the IRQ status bit is set.
An SMI or PME event will be generated.
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Publication Release Date: March, 2006
W83637HF/HG
Revision 1.6