km416rd8ac Samsung Semiconductor, Inc., km416rd8ac Datasheet - Page 61

• Manufacturer Part Number: km416rd8ac
• Description: 128/144mbit Rdram 256k X 16/18 Bit X 2*16 Dependent Banks Direct Rdramtm
• Manufacturer: Samsung Semiconductor, Inc.

KM416RD8AC(D)/KM418RD8AC(D)
Center-Bonded uBGA Package
Figure 61 shows the form and dimensions of the recom-
mended package for the center-bonded CSP device class.
E1
12
11
10
9
8
7
6
5
4
3
2
1
Figure 61: Center-Bonded uBGA Package
A
B
C
d
a. The E,MAX parameter for SO-RIMM applications is 0.94mm.
D
e1
e2
A
D
E
E1
d
e1
Symbol
D
E
F
Ball pitch (x-axis)
Ball pitch (y-axis)
Package body length
Package body width
Package total thickness
Ball height
Ball diameter
G
H
Parameter
J
Page 58
e2
Table 27 lists the numerical values corresponding to dimen-
sions shown in Figure 61.
Bottom
Table 27: Center-Bonded uBGA Package Dimensions
Top
E
A
Min
(128Mb/144Mb)
11.90
10.10
1.00
0.80
0.20
0.30
-
Top
Rev. 1.01 Oct. 1999
Direct RDRAM
Max
(128Mb/144Mb)
12.10
10.30
1.00
1.00
0.80
0.30
0.40
a
Bottom
Unit
mm
mm
mm
mm
mm
mm
mm
™