ppc405exr Applied Micro Circuits Corporation (AMCC), ppc405exr Datasheet - Page 49

• Manufacturer Part Number: ppc405exr
• Description: Powerpc 405exr Embedded Processor
• Manufacturer: Applied Micro Circuits Corporation (AMCC)

PPC405EXr – PowerPC 405EXr Embedded Processor
Table 9. Package Thermal Specifications
The PPC405EXr is designed to operate within a case temperature range
Conditions” on page 50. Thermal resistance values for the EPBGA packages in a convection environment are as follows:
Thermal Management
The following heat sink was used in the above thermal analysis:
The heat sink is manufactured by:
AMCC Proprietary
Junction-to-ambient
thermal resistance
without heat sink
Junction-to-ambient
thermal resistance
with heat sink
Junction-to-case thermal
resistance
Junction-to-board thermal
resistance
Notes:
1. Values in the table are achieved with the following JEDEC standard board: 114.5mm x 101.6mm x 1.6mm, 4 layers.
2. For a chip mounted on a card with at least one signal and two power planes, the following relationships exist:
26.92mm x 27mm x 11.43mm
Aavid Thermalloy, P/N 62925
a. Case temperature, T
b. T
c. T
Parameter
A
C Max
= T
C
= T
– Pxθ
J Max
CA
– Pxθ
, where T
C
JC
, is measured at top center of case surface with device soldered to circuit board.
Symbol
, where T
θ
θ
θ
θ
A
JA
JA
JC
JB
is ambient temperature and P is power consumption.
JMax
0 (0)
18.9
15.5
is maximum junction temperature and P is power consumption.
100 (0.51)
16.6
12.5
200 (1.02)
15.8
11.4
Resistance Value
ft/min (m/sec)
300 (1.52)
T
Airflow
C
13.74
15.4
10.9
8.96
defined in “Recommended DC Operating
400 (2.02)
Preliminary Data Sheet
15.0
10.7
Revision 1.10 - July 10, 2008
500 (2.53)
14.7
10.5
600 (3.03)
14.4
10.3
°C/W
°C/W
°C/W
°C/W
Unit
49