dsPIC33FJ32MC104-I/PT Microchip Technology, dsPIC33FJ32MC104-I/PT Datasheet - Page 33

• Manufacturer Part Number: dsPIC33FJ32MC104-I/PT
• Description: Digital Signal Processors & Controllers - DSP, DSC 16bit Mtr Cnt Fam 16 MIPS 32KBFLSH 2KBRAM
• Manufacturer: Microchip Technology
• Type: dsPIC33FJ32(GP/MC)101/102/104r

Specifications of dsPIC33FJ32MC104-I/PT

• Rohs: yes
• Core: dsPIC33F
• Data Bus Width: 16 bit
• Program Memory Size: 32 KB
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 7.37 MHz, 32 kHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5 x 16-bit, 2 x 32-bit
• Device Million Instructions Per Second: 16 MIPs
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Package / Case: TQFP-44
• Mounting Style: SMD/SMT
• Family / Core: dsPIC33FJ32(GP/MC)101/102/104
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: Yes
• Product: DSPs
• Program Memory Type: Flash
• Supply Current: 10 mA

2.0
2.1
Getting started with the dsPIC33FJ16(GP/MC)101/102
and dsPIC33FJ32(GP/MC)101/102/104 family of 16-bit
Digital Signal Controllers (DSCs) requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
 2011-2012 Microchip Technology Inc.
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(regardless if ADC module is not used)
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(see
Connection (V
(see
Programming™ (ICSP™) and debugging purposes
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source is used
(see
Note 1: This data sheet summarizes the features
CAP
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
DD
Section 2.2 “Decoupling
Section 2.2 “Decoupling
Section 2.3 “CPU Logic Filter Capacitor
Section 2.4 “Master Clear (MCLR)
Section 2.5 “ICSP
Section 2.6 “External Oscillator
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
Basic Connection Requirements
and V
and AV
of
and dsPIC33FJ32(GP/MC)101/102/104
family devices. It is not intended to be
a comprehensive reference source. To
complement
this data
“dsPIC33F/PIC24H Family Reference
Manual”. Please see the Microchip web
site (www.microchip.com) for the latest
“dsPIC33F/PIC24H Family Reference
Manual” sections.
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
this data sheet for device-specific register
and bit information.
SS
the
CAP
SS
pins
)”)
pins, if present on the device
dsPIC33FJ16(GP/MC)101/102
sheet,
Pins”)
the
Capacitors”)
Capacitors”)
information
refer
Pins”)
Pin”)
to
the
in
in
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high-frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10V-20V. This capacitor
should be a low-ESR and have resonance
frequency in the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high-frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70652E-page 33
SS
, AV
DD
, and