dsPIC33FJ32MC104-I/PT Microchip Technology, dsPIC33FJ32MC104-I/PT Datasheet - Page 34

no-image

dsPIC33FJ32MC104-I/PT

Manufacturer Part Number
dsPIC33FJ32MC104-I/PT
Description
Digital Signal Processors & Controllers - DSP, DSC 16bit Mtr Cnt Fam 16 MIPS 32KBFLSH 2KBRAM
Manufacturer
Microchip Technology
Type
dsPIC33FJ32(GP/MC)101/102/104r
Datasheet

Specifications of dsPIC33FJ32MC104-I/PT

Rohs
yes
Core
dsPIC33F
Data Bus Width
16 bit
Program Memory Size
32 KB
Data Ram Size
2 KB
Maximum Clock Frequency
7.37 MHz, 32 kHz
Number Of Programmable I/os
35
Number Of Timers
5 x 16-bit, 2 x 32-bit
Device Million Instructions Per Second
16 MIPs
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Package / Case
TQFP-44
Mounting Style
SMD/SMT
Family / Core
dsPIC33FJ32(GP/MC)101/102/104
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
Yes
Product
DSPs
Program Memory Type
Flash
Supply Current
10 mA

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ32MC104-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
FIGURE 2-1:
2.2.1
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that con-
nects the power supply source to the device, and the
maximum current drawn by the device in the applica-
tion. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3
A low-ESR (< 5 Ohms) capacitor is required on the
V
regulator output voltage. The V
connected to V
4.7 µF and 10 µF, 16V connected to ground. The type
can be ceramic or tantalum. Refer to
“Electrical
information.
DS70652E-page 34
CAP
Ceramic
V
0.1 µF
Note 1:
DD
R
C
pin, which is used to stabilize the voltage
R1
CPU Logic Filter Capacitor
Connection (V
TANK CAPACITORS
As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between V
AV
impedance should be less than 1 and the inductor
capacity greater than 10 mA.
Where:
L
f
f
Tantalum
L1
MCLR
V
V
DD
DD
=
=
=
Characteristics”
10 µF
SS
DD
(1)
, and must have a capacitor between
to improve ADC noise rejection. The inductor
F
------------- -
---------------------- -
2 LC
--------------------- -
CNV
2f C
2
1
1
RECOMMENDED
MINIMUM CONNECTION
dsPIC33F
Ceramic
CAP
0.1 µF
(i.e., ADC conversion rate/2)
2
)
CAP
pin must not be
for
V
V
Section 26.0
DD
Ceramic
SS
Ceramic
0.1 µF
0.1 µF
additional
Ceramic
0.1 µF
DD
and
The placement of this capacitor should be close to the
V
exceed one-quarter inch (6 mm). Refer to
“On-Chip Voltage Regulator”
2.4
The
functions:
• Device Reset
• Device programming and debugging
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (V
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
CAP
Note 1: R  10 k is recommended. A suggested
. It is recommended that the trace length not
example,
MCLR
2: R1  470 will limit any current flowing into
Master Clear (MCLR) Pin
starting value is 10 k. Ensure that the
MCLR pin V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
V
IH
DD
R
pin
JP
and V
C
(1)
as
 2011-2012 Microchip Technology Inc.
provides
IL
shown
EXAMPLE OF MCLR PIN
CONNECTIONS
specifications are met.
IH
R1
and V
(2)
IH
and V
IL
MCLR
in
for details.
two
specifications are met.
dsPIC33F
IL
Figure
Figure 2-2
) and fast signal
specific
Section 23.2
2-2,
device
within
it
is

Related parts for dsPIC33FJ32MC104-I/PT