S29GL256S90DHI023 Spansion, S29GL256S90DHI023 Datasheet - Page 65

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S29GL256S90DHI023

Manufacturer Part Number
S29GL256S90DHI023
Description
Flash 256M, 3V, 90ns Parallel NOR Flash
Manufacturer
Spansion
Datasheet

Specifications of S29GL256S90DHI023

Rohs
yes
Data Bus Width
16 bit
Memory Type
NOR Flash
Memory Size
256 Mbit
Architecture
Eclipse
Timing Type
Asynchronous
Interface Type
CFI
Access Time
90 ns
Supply Voltage - Max
3.6 V
Supply Voltage - Min
2.7 V
Maximum Operating Current
60 mA
Operating Temperature
- 40 C to + 85 C
Mounting Style
SMD/SMT
Package / Case
FBGA-64
Organization
128 KB x 128
Hardware Interface
7. Signal Descriptions
7.1
7.2
7.3
December 21, 2012 S29GL_128S_01GS_00_07
Address and Data Configuration
Input/Output Summary
Versatile I/O Feature
Address and data are connected in parallel (ADP) via separate signal inputs and I/Os.
The maximum output voltage level driven by, and input levels acceptable to, the device are determined by the
V
same bus having interface signal levels different from the device core voltage.
RESET#
CE#
OE#
WE#
A
DQ15-DQ0
WP#
RY/BY#
V
V
V
NC
RFU
DNU
IO
MAX
CC
IO
SS
power supply. This supply allows the device to drive and receive signals to and from other devices on the
-A0
Symbol
Output - open drain
Input
Input
Input
Input
Input
Input/Output
Input
Power Supply
Power Supply
Power Supply
No Connect
No Connect
Reserved
D a t a
Type
GL-S MirrorBit
S h e e t
Hardware Reset. At V
for reading array data.
Chip Enable. At V
Output Enable. At V
high impedance (High-Z).
Write Enable. At V
transfer is from device to host.
Address inputs.
A25-A0 for S29GL01GS
A24-A0 for S29GL512S
A23-A0 for S29GL256S
A22-A0 for S29GL128S
Data inputs and outputs
Write Protect. At V
64-kword (128-kB) sector of the device. At V
internal pull up; When unconnected WP# is at V
Ready/Busy. Indicates whether an Embedded Algorithm is in progress or complete. At V
the device is actively engaged in an Embedded Algorithm such as erasing or programming.
At High-Z, the device is ready for read or a new command write - requires external pull-up
resistor to detect the High-Z state. Multiple devices may have their RY/BY# outputs tied
together to detect when all devices are ready.
Core power supply
Versatile IO power supply.
Power supplies ground
Not Connected internally. The pin/ball location may be used in Printed Circuit Board (PCB)
as part of a routing channel.
Reserved for Future Use. Not currently connected internally but the pin/ball location should
be left unconnected and unused by PCB routing channel for future compatibility. The pin/ball
may be used by a signal in the future.
Do Not Use. Reserved for use by Spansion. The pin/ball is connected internally. The input
has an internal pull down resistance to V
the PCB.
Table 7.1 I/O Summary
®
Family
IL
IL
IL
, selects the device for data transfer with the host memory controller.
IL
, indicates data transfer from host to device. At V
, disables program and erase functions in the lowest or highest address
, causes outputs to be actively driven. At V
IL
, causes the device to reset control logic to its standby state, ready
Description
SS
. The pin/ball can be left open or tied to V
IH
, the sector is not protected. WP# has an
IH
.
IH
, causes outputs to be
IH
, indicates data
SS
on
IL
65
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