S29GL256S90DHI023 Spansion, S29GL256S90DHI023 Datasheet - Page 92

• Manufacturer Part Number: S29GL256S90DHI023
• Description: Flash 256M, 3V, 90ns Parallel NOR Flash
• Manufacturer: Spansion

Specifications of S29GL256S90DHI023

• Rohs: yes
• Data Bus Width: 16 bit
• Memory Type: NOR Flash
• Memory Size: 256 Mbit
• Architecture: Eclipse
• Timing Type: Asynchronous
• Interface Type: CFI
• Access Time: 90 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Current: 60 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: FBGA-64
• Organization: 128 KB x 128

92
11.1.2
Physical Diagram
PACKAGE
SYMBOL
JEDEC
D1
A1
A2
b1
c1
A
E
O
R
N
b
c
D
e
L
19.80
18.30
13.90
MIN.
0.05
0.95
0.17
0.17
0.10
0.10
0.50
0.08
---
0˚
MO-142 (B) EC
Figure 11.2 56-Pin Thin Small Outline Package (TSOP), 14 x 20 mm
0.50 BASIC
TS 56
NOM.
20.00
18.40
14.00
1.00
0.20
0.22
0.60
56
---
---
---
---
-
---
MAX.
20.20
18.50
14.10
1.20
0.15
1.05
0.23
0.27
0.16
0.21
0.70
0.20
8˚
GL-S MirrorBit
D a t a
NOTES:
1
2
3
4
5
6
7
8
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982.)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE
LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE
MOLD PROTUSION IS 0.15 mm PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE
DAMBAR PROTUSION SHALL BE 0.08 mm TOTAL IN EXCESS OF b
DIMENSION AT MAX MATERIAL CONDITION. MINIMUM SPACE BETWEEN
PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 mm.
THESE DIMESIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10 mm AND 0.25 mm FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED FROM THE
SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
®
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
Family
S h e e t
S29GL_128S_01GS_00_07 December 21, 2012
3160\38.10A