M29W640GT70NA6E NUMONYX, M29W640GT70NA6E Datasheet - Page 82

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M29W640GT70NA6E

Manufacturer Part Number
M29W640GT70NA6E
Description
IC FLASH 64MBIT 70NS 48TSOP
Manufacturer
NUMONYX
Series
Axcell™r
Datasheet

Specifications of M29W640GT70NA6E

Format - Memory
FLASH
Memory Type
FLASH - Nor
Memory Size
64M (8Mx8, 4Mx16)
Speed
70ns
Interface
Parallel
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
48-TSOP
Cell Type
NOR
Density
64Mb
Access Time (max)
70ns
Interface Type
Parallel
Boot Type
Top
Address Bus
23/22Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
8M/4M
Supply Current
10mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Appendix D
D.1
D.2
Note:
82/90
Block protection can be used to prevent any operation from modifying the data stored in the
memory. The blocks are protected in groups, refer to
Table 29
erase operations within the protected group fail to change the data.
There are three techniques that can be used to control block protection, these are the
programmer technique, the in-system technique and temporary unprotection. Temporary
unprotection is controlled by the Reset/Block Temporary Unprotection pin, RP; this is
described in the
Programmer technique
The programmer technique uses high (V
cannot be achieved using a standard microprocessor bus, therefore the technique is
recommended only for use in programming equipment.
To protect a group of blocks follow the flowchart in
protect
then all groups can be unprotected at the same time. To unprotect the chip follow
Programmer equipment chip unprotect
operations, BYTE = VIH or
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not abort the procedure before
reaching the end. Chip unprotect can take several seconds and a user message should be
provided to show that the operation is progressing.
In-system technique
The in-system technique requires a high voltage level on the Reset/Blocks Temporary
Unprotect pin, RP
components on the microprocessor bus, therefore this technique is suitable for use after the
memory has been fitted to the system.
To protect a group of blocks follow the flowchart in
protect
then all the groups can be unprotected at the same time. To unprotect the chip follow
Figure 29: In-system equipment chip unprotect
The timing on these flowcharts is critical. Care should be taken to ensure that, where a
pause is specified, it is followed as closely as possible. Do not allow the microprocessor to
service interrupts that will upset the timing and do not abort the procedure before reaching
the end. Chip unprotect can take several seconds and a user message should be provided
to show that the operation is progressing.
RP can be either at V
extended block.
flowchart. To unprotect the whole chip it is necessary to protect all of the groups first,
flowchart. To unprotect the whole chip it is necessary to protect all of the groups first,
and
Block protection
Table 30
Section 2: Signal
(1)
. This can be achieved without violating the maximum ratings of the
IH
for details of the protection groups. Once protected, program and
or at V
VIL, gives a summary of each operation.
ID
when using the in-system technique to protect the
descriptions.
flowchart.
ID
) voltage levels on some of the bus pins. These
flowchart.
Table 38: Programmer technique bus
Figure 26: Programmer equipment group
Figure 28: In-system equipment group
Appendix A: Block
addresses,
Figure 27:

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