MT45W4MW16BFB-706 WT TR Micron Technology Inc, MT45W4MW16BFB-706 WT TR Datasheet

IC PSRAM 64MBIT 70NS 54VFBGA

MT45W4MW16BFB-706 WT TR

Manufacturer Part Number
MT45W4MW16BFB-706 WT TR
Description
IC PSRAM 64MBIT 70NS 54VFBGA
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT45W4MW16BFB-706 WT TR

Format - Memory
RAM
Memory Type
PSRAM (Page)
Memory Size
64M (4M x 16)
Speed
70ns
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.95 V
Operating Temperature
-30°C ~ 85°C
Package / Case
54-VFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Async/Page/Burst CellularRAM
MT45W4MW16B*
*Note: Not recommended for new designs.
For the latest data sheet, refer to Micron’s Web site:
Features
• Single device supports asynchronous, page, and
• Random access time: 70ns
• V
• Page mode read access
• Burst mode write access
• Burst mode read access
• Low power consumption
• Low-power features
PDF: 09005aef80be1fbd/Source: 09005aef80be2036
Burst CellularRAM_1.fm - Rev. G 10/05 EN
Options
• Configuration:
• Package
• Timing
burst operations
1.70V–1.95V V
1.70V–3.30V V
Sixteen-word page size
Interpage read access: 70ns
Intrapage read access: 20ns
Continuous burst
4, 8, or 16 words, or continuous burst
MAX clock rate: 80 MHz (
Burst initial latency: 50ns (4 clocks) @ 80 MHz
t
Asynchronous READ: <25mA
Intrapage READ: <15mA
Initial access, burst READ:
(50ns [4 clocks] @ 80 MHz) < 35mA
Continuous burst READ: <15mA
Standby: 120µA – standard
100µA – low-power option
Deep power-down: <10µA (TYP @ 25°C)
Temperature-compensated refresh (TCR)
Partial-array refresh (PAR)
Deep power-down (DPD) mode
4 Meg x 16
54-ball VFBGA (standard)
54-ball VFBGA (lead-free)
70ns access
85ns access
ACLK: 9ns @ 80 MHz
CC
, V
CC
Q voltages
Products and specifications discussed herein are subject to change by Micron without notice.
CC
CC
Q
t
CLK = 12.5ns)
64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
MT45W4MW16B
Designator
BB
-70
-85
FB
2
http://www.micron.com/products/psram/
1
1
TM
Figure 1:
Notes: 1. Not recommended for new designs.
Options (continued)
• Frequency
• Standby power
• Operating temperature range
1.0 Memory
66 MHz
80 MHz
Standard
Low-power
Wireless (-30°C to +85°C)
Industrial (-40°C to +85°C)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2. Contact factory.
3. -30°C exceeds the CellularRAM Working
MT45W4MW16BFB-708LWT
Group 1.0 specification of -25°C.
A
D
G
H
B
C
E
F
J
Ball Assignment – 54-Ball VFBGA
DQ14
DQ15
WAIT
V
V
DQ8
DQ9
A18
LB#
CC
1
SS
Part Number Example:
Q
Q
DQ10
DQ11
DQ12
DQ13
OE#
UB#
A19
CLK
A8
2
(Ball Down)
ADV#
A17
A21
A14
A12
Top View
A0
A3
A5
A9
3
A16
A15
A13
A10
A1
A4
A6
A7
NC
©2003 Micron Technology, Inc. All rights reserved.
4
DQ1
DQ3
DQ4
DQ5
WE#
CE#
A11
A2
NC
5
Designator
DQ0
DQ2
DQ6
DQ7
CRE
A20
V
V
NC
6
CC
SS
None
WT
IT
Features
6
8
L
2
3

Related parts for MT45W4MW16BFB-706 WT TR

MT45W4MW16BFB-706 WT TR Summary of contents

Page 1

... A15 DQ5 DQ6 G A13 DQ7 DQ15 A19 A12 WE# H A18 A8 A9 A10 A11 A20 J WAIT CLK ADV Top View (Ball Down) Designator Group 1.0 specification of -25°C. Part Number Example: MT45W4MW16BFB-708LWT ©2003 Micron Technology, Inc. All rights reserved. Features 6 8 None ...

Page 2

... Maximum and Typical Standby Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30 Timing Diagrams .37 Revision History .60 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAMTOC.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory Micron Technology, Inc., reserves the right to change products or specifications without notice. 2 Table of Contents ©2003 Micron Technology, Inc. All rights reserved. ...

Page 3

... Figure 47: Asynchronous WRITE Followed by Asynchronous READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58 Figure 48: 54-Ball VFBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAMLOF.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 TCR Micron Technology, Inc., reserves the right to change products or specifications without notice. 3 List of Figures ©2003 Micron Technology, Inc. All rights reserved. ...

Page 4

... Table 46: READ Timing Parameters – Async WRITE Followed by Async READ . . . . . . . . . . . . . . . . . . . . . . . . . . .58 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAMLOT.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory Micron Technology, Inc., reserves the right to change products or specifications without notice. 4 List of Tables ©2003 Micron Technology, Inc. All rights reserved. ...

Page 5

... General Description Micron for low-power, portable applications. The MT45W4MW16BFB is a 64Mb DRAM core device organized as 4 Meg x 16 bits. This device includes an industry-standard burst mode Flash interface that dramatically increases read/write bandwidth compared with other low-power SRAM or Pseudo SRAM offerings. To operate seamlessly on a burst Flash bus, CellularRAM products incorporate a trans- parent self refresh mechanism ...

Page 6

... Output Enable: Enables the output buffers when LOW. When OE# is HIGH, the output buffers are disabled. Write Enable: Determines if a given cycle is a WRITE cycle. If WE# is LOW, the cycle is a WRITE to either a configuration register or to the memory array. Lower Byte Enable. DQ[7:0] Upper Byte Enable. DQ[15:8] Data Inputs/Outputs ...

Page 7

... When the device is in standby mode, address inputs and data inputs/outputs are internally isolated from any external influence current. 7. DPD is maintained until RCR is reconfigured. 8. Burst mode operation is initialized through the bus configuration register (BCR[15]). PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory 1 CLK ADV# CE# OE# WE ...

Page 8

... To view the location of the abbre- viated mark on the device, please refer to customer service note, CSN-11, “Product Mark/Label," at http://www.micron.com/csn. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory B FB -70 6 http://www.micron.com/partsearch Micron Technology, Inc ...

Page 9

... Functional Description In general, the MT45W4MW16BFB device is a high-density alternative to SRAM and Pseudo SRAM products, popular in low-power, portable applications. The MT45W4MW16BFB device contains a 67,108,864-bit DRAM core, organized as 4,194,304 addresses by 16 bits. The device implements the same high-speed bus inter- face found on burst mode Flash products. ...

Page 10

... WAIT will be driven while the device is enabled and its state should be ignored. Page mode is enabled by setting RCR[7] to HIGH. ADV must be driven LOW during all page mode read accesses. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory ADDRESS VALID DATA VALID READ Cycle Time < t CEM ...

Page 11

... CellularRAM device. The WAIT output will be asserted as soon as CE# goes LOW and will be de-asserted to indicate when data transferred into (or out of ) the memory. WAIT will again be asserted if the burst crosses the boundary between 128-word rows. Once the Cellular- RAM device has restored the previous row’ ...

Page 12

... Non-default BCR settings for burst mode WRITE (4-word burst): Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory VALID Latency Code 2 (3 clocks) D[0] ...

Page 13

... CellularRAM device requires additional time before data can be transferred. For READ operations, WAIT will remain active until valid data is output from the device. For WRITE operations, WAIT will indicate to the memory controller when data will be accepted into the CellularRAM device. When WAIT transitions to an inactive state, the data burst will progress on successive clock edges ...

Page 14

... Non-default BCR settings for refresh collision during READ operation: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory D[0] Micron Technology, Inc., reserves the right to change products or specifications without notice. 14 ...

Page 15

... Non-default BCR settings for refresh collision during WRITE operation: Latency code two (three clocks); WAIT active LOW; WAIT asserted during delay. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory D[0] Micron Technology, Inc., reserves the right to change products or specifications without notice. 15 ...

Page 16

... Partial-array refresh (PAR) restricts refresh operation to a portion of the total memory array. This feature enables the device to reduce standby current by refreshing only that part of the memory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth array, or none of the array. The mapping of these partitions can start at either the beginning or the end of the address map (see Table 6 on page 27) ...

Page 17

... WRITE operation when the control register enable (CRE) input is HIGH (see Figure 13 below and Figure 14 on page 18). When CRE is LOW, a READ or WRITE operation will access the memory array. The register values are placed on addresses A[21:0 asyn- chronous WRITE, the values are latched into the configuration register on the rising edge of ADV#, CE#, or WE#, whichever occurs first ...

Page 18

... WAIT cycles caused by refresh collisions require a corresponding number of addi- tional CE# LOW cycles. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory Latch Control Register Address Micron Technology, Inc., reserves the right to change products or specifications without notice. 18 ...

Page 19

... Figure 15: Load Configuration Register ADDRESS CE# OE# WE# LB#/UB# DATA Note: The WRITE on the third cycle must be CE#-controlled. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory 1 READ READ WRITE ADDRESS ADDRESS ADDRESS (MAX) (MAX) (MAX) XXXXh ...

Page 20

... Notes: 1. The WRITE on the third cycle must be CE#-controlled. 2. CE# must be HIGH for 150ns before performing the cycle that reads a configuration regis- ter. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory 1 READ READ WRITE ADDRESS ...

Page 21

... Bus Configuration Register The BCR defines how the CellularRAM device interacts with the system memory bus. Page mode operation is enabled by a bit contained in the RCR. Figure 17 describes the control bits in the BCR. At power-up, the BCR is set to 9D4Fh. The BCR is accessed using CRE and A[19] HIGH, or through the configuration register software sequence with DQ = 0001h on the third cycle ...

Page 22

... PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory 8-Word 16-Word Burst Length Burst Length ...

Page 23

... The WAIT configuration bit is used to determine when WAIT transitions between the asserted and the de-asserted state with respect to valid data presented on the data bus. The memory controller will use the WAIT signal to coordinate data transfer during syn- chronous READ and WRITE operations. When BCR[ data will be valid or invalid on the clock edge immediately after WAIT transitions to the de-asserted or asserted state, respectively (see Figure 18 and Figure 20) ...

Page 24

... V IH ADV DQ[15: DQ[15: PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory D[0] D[1] Code 2 VALID OUTPUT Code 3 (Default) 24 Configuration Registers BCR[ Data valid in current cycle. BCR[ Data valid in next cycle. D[2] D[3] D[4] DON’T CARE ...

Page 25

... The operating mode bit selects either synchronous burst operation or the default asyn- chronous mode of operation. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory Micron Technology, Inc., reserves the right to change products or specifications without notice. 25 Configuration Registers ...

Page 26

... Page Mode Disabled (default) 1 Page Mode Enable Maximum Case Temp. RCR[6] RCR[5] 1 +85˚C (default) 1 +70˚ +45˚ +15˚C 0 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory A19 A[18: 18– RESERVED PAGE TCR DPD Must be set to "0" RCR[4] 0 ...

Page 27

... Partial-Array Refresh (RCR[2:0]) Default = Full Array Refresh The PAR bits restrict refresh operation to a portion of the total memory array. This fea- ture allows the device to reduce standby current by refreshing only that part of the mem- ory array required by the host system. The refresh options are full array, one-half array, one-quarter array, one-eighth array, or none of the array ...

Page 28

... Exposure to absolute maximum rating conditions for extended periods may affect reli- ability. Notes: 1. -30°C exceeds the CellularRAM Working Group 1.0 specification of -25°C. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory Q Relative to V -0.50V to (4. Micron Technology, Inc ...

Page 29

... V slightly higher for up to 500ms after power-up or when entering standby mode. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory 1 (-30ºC < T < +85ºC); Industrial Temperature (-40ºC < T ...

Page 30

... Maximum and Typical Standby Currents The following tables and figures refer to the maximum and typical standby currents for the MT45W4MW16BFB device. The typical values shown in Figure 23 on page 31 are measured with the appropriate PAR and TCR settings. The maximum values shown in Table 9 and Table 11 are measured with the relevant TCR bits set in the configuration register ...

Page 31

... Note: Typical I Table 11: Deep Power-Down Specifications Description Deep Power-Down PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory ) TCR Temperature (°C) currents for each PAR setting with the appropriate TCR selected. SB Conditions 0V; +25°C ...

Page 32

... Output Load Circuit DUT Note: All tests are performed with the outputs configured for full drive strength (BCR[5] = 0). Table 13: Output Load Circuit PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory Conditions Symbol T = +25º MHz ...

Page 33

... Low-Z timings measure a 100mV transition away from the High-Z (V either V 4. Low-Z to High-Z timings are tested with the circuit shown in Figure 25 on page 32. The High-Z timings measure a 100mV transition from either V PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory Symbol AADV ...

Page 34

... High-Z to Low-Z timings are tested with the circuit shown in Figure 25 on page 32. The Low-Z timings measure a 100mV transition away from the High-Z (V either V PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory -708 Symbol Min t ABA ...

Page 35

... Low-Z to High-Z timings are tested with the circuit shown in Figure 25 on page 32. The High-Z timings measure a 100mV transition from either V 3. WE# LOW time must be limited to PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory Symbol AVH ...

Page 36

... Notes: 1. When configured for synchronous mode (BCR[15] = 0), a refresh opportunity must be pro- vided every tions: a) clocked CE# HIGH CE# HIGH for greater than 15ns. 2. Clock rates below 50 MHz ( PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory -708 Symbol Min t 5 ...

Page 37

... Vcc, VccQ = 1.70V Table 18: Initialization Timing Parameters Parameter Initialization Period (required before normal operations) PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t PU Symbol t PU Micron Technology, Inc., reserves the right to change products or specifications without notice. ...

Page 38

... A[21:0] ADV# CE# LB#/UB# OE# WE# DQ[15:0] WAIT Table 19: Asynchronous READ Timing Parameters -70x Symbol Min Max Min BHZ 8 t BLZ 10 t CEW 1 7 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory VALID ADDRESS OLZ BLZ High-Z ...

Page 39

... Asynchronous READ Timing Parameters Using ADV# -70x Symbol Min Max Min AADV t 5 AVH t AVS BHZ BLZ t CEW 1 7 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory V IH VALID ADDRESS VPH t AVS t AVH AADV CVS OLZ V ...

Page 40

... Asynchronous READ Timing Parameters – Page Mode Operation -70x Symbol Min Max Min APA BHZ t BLZ 10 t CEM 8 t CEW 1 7 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory VALID ADDRESS VALID VALID ADDRESS V ADDRESS CEM ...

Page 41

... ACLK BOE t 8 CEM t CEW 1 7.5 t CLK 12 4.5 20 CSP PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CLK CEM t t ABA BOE OHZ t OLZ t KHTL t KOH t ACLK VALID OUTPUT t CLK > 20ns) are allowed as long as ...

Page 42

... CEW 1 7 CLK t CSP 4 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t KHKL t CLK t CEM t ABA t BOE t OLZ t KHTL t ACLK VALID High-Z OUTPUT t CLK > 20ns) are allowed as long as -706/-856 Max Units Symbol t ...

Page 43

... CEW t 12 CLK t CSP 4 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CLK t CEM t ABA t BOE t OLZ t KHTL t KOH t ACLK VALID OUTPUT t CLK > 20ns) are allowed as long as -706/-856 Max Units Symbol t 56 ...

Page 44

... ACLK 9 t BOE CBPH t 8 CEM t CLK 12 CSP 4.5 20 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CLK t CEM t OHZ t BOE t KOH VALID VALID VALID VALID OUTPUT OUTPUT OUTPUT OUTPUT t CLK > 20ns) are allowed as long as ...

Page 45

... Burst READ Timing Parameters – BCR[ -708 Symbol Min Max Min t 9 ACLK t 12.5 20 CLK PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory NOTE 4 t KHTL NOTE 3 VALID OUTPUT t CLK > 20ns) are allowed as long as -706/-856 Max Units Symbol ...

Page 46

... LB#/UB# OE# WE# DQ[15:0] IN DQ[15:0] OUT WAIT Table 27: Asynchronous WRITE Timing Parameters – CE#-Controlled -70x Symbol Min Max Min CEW 1 7 CPH PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory VALID ADDRESS WPH High WHZ V OH ...

Page 47

... LB#/UB# OE# WE# DQ[15:0] IN DQ[15:0] OUT WAIT Table 28: Asynchronous WRITE Timing Parameters – LB#/UB#-Controlled -70x Symbol Min Max Min 7.5 CEW PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory VALID ADDRESS WPH High WHZ t LZ ...

Page 48

... ADV# CE# LB#/UB# OE# WE# DQ[15:0] IN DQ[15:0] OUT WAIT Table 29: Asynchronous WRITE Timing Parameters – WE#-Controlled -70x Symbol Min Max Min CEW 1 7 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory VALID ADDRESS WPH High WHZ CEW ...

Page 49

... DQ[15:0] IN DQ[15:0] OUT WAIT Table 30: Asynchronous WRITE Timing Parameters Using ADV# -70x Symbol Min Max Min AVH t AVS 7.5 CEW PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory V IH VALID ADDRESS AVH t AVS VPH High ...

Page 50

... Min t CBPH 5 t CEM 8 t CEW 1 7.5 t 12.5 20 CLK t 4.5 20 CSP PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CLK CEM t KHTL D[0] t CLK > 20ns) are allowed as long as -706/-856 Max Units Symbol µs KHKL ...

Page 51

... Symbol Min Max Min t CLK 12 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory NOTE 4 t KHTL NOTE 3 VALID INPUT D[n+1] START OF ROW (NOTE 4) t CLK > 20ns) are allowed as long as -706/-856 Max Units Symbol t ...

Page 52

... Min t ABA 46 ACLK t 20 BOE t CLK 12 CSP 4.5 20 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t SP ADDRESS CBPH CSP D[0] D[1] D[2] D[ CEM. A refresh opportunity is satisfied by either of the following two condi- t CLK > 20ns) are allowed as long as ...

Page 53

... Symbol Min Max Min t ABA 46.5 t ACLK BOE t 5 CBPH t CEW 1 7.5 t CLK 12.5 20 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CLK CKA VALID VALID ADDRESS ADDRESS CSP t ABA t CBPH WPH t CEW V OH ...

Page 54

... Symbol Min Max Min t 46.5 ABA t ACLK 9 t BOE 20 t CBPH 7.5 CEW t CLK 12.5 20 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CLK CKA VALID ADDRESS CBPH t CSP t ABA CEW V OH DATA High CEM ...

Page 55

... Symbol Min Max Min PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CLK ABA t t BOE OHZ t OLZ t KHTL t KOH t ACLK VALID OUTPUT t CEM. A refresh opportunity is satisfied by either of the following two condi- Max Units Symbol ...

Page 56

... AVH AVS CEW 1 7 PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CLK t VPH ABA BOE OHZ t OLZ t KHTL t t ACLK KOH VALID OUTPUT t CEM. A refresh opportunity is satisfied by either of the following two condi- Max Units ...

Page 57

... READ Timing Parameters – ADV# LOW -70x Symbol Min Max Min BHZ t BLZ PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory VALID ADDRESS CPH High-Z DATA CPH) to schedule the appropriate internal refresh operation. Otherwise, -856 Max Units Symbol ...

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... Max Min AADV t AVH 5 t AVS 10 t BHZ BLZ PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory VALID ADDRESS t AVH AVS CVS t CPH WPH V OH DATA DATA CPH) to schedule the appropriate internal refresh operation. Otherwise, ...

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... This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range for production devices. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory 0.70 ±0.05 3.75 0.75 BALL A1 ID TYP 4.00 ± ...

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... Clarified READ/WRITE operating currents. • Added clarifying notes for required refresh opportunity for BCR[15], depending on BCR setting. • Changed PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory t CEM for async WRITES. 3 for READ and WRITE CPH to follow CE#-controlled async WRITE cycles only ...

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... Added V & L options. Modified WAIT in bus operations. Indicated wrap factors. • Added -706 part information where applicable. • Removed PDF: 09005aef80be1fbd/Source: 09005aef80be2036 Burst CellularRAM_2.fm - Rev. G 10/05 EN 64Mb: 4 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory values and symbols Fig. 47 and Table 46. ...

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