IC BUCK SYNC ADJ 6A 25MLP

FAN2106MPX

Manufacturer Part NumberFAN2106MPX
DescriptionIC BUCK SYNC ADJ 6A 25MLP
ManufacturerFairchild Semiconductor
SeriesTinyBuck™
TypeStep-Down (Buck)
FAN2106MPX datasheet
 


Specifications of FAN2106MPX

Internal Switch(s)YesSynchronous RectifierYes
Number Of Outputs1Voltage - Output3 ~ 21 V
Current - Output6AFrequency - Switching300kHz ~ 600kHz
Voltage - Input3 ~ 24 VOperating Temperature-10°C ~ 85°C
Mounting TypeSurface MountPackage / Case25-MLP
Power - Output2.8WMounting StyleSMD/SMT
Operating Temperature Range- 10 C to + 85 COutput Voltage0.4 V to 3.2 V
Primary Input Voltage24VNo. Of Outputs1
Output Current6ANo. Of Pins25
Filter TerminalsSMDOutput Current Max6A
Rohs CompliantYesInput Voltage Primary Max24V
For Use WithFEB167 - BOARD EVAL FOR FAN2106Lead Free Status / RoHS StatusLead free / RoHS Compliant
Other namesFAN2106MPXTR  
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Parameter
VIN to PGND
VCC to AGND
AGND = PGND
BOOT to PGND
BOOT to SW
Continuous
SW to PGND
Transient (t < 20ns, f < 600KHz)
All other pins
Human Body Model, JEDEC JESD22-A114
ESD
Charged Device Model, JEDEC JESD22-C101
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
V
Bias Voltage
CC
V
Supply Voltage
IN
T
Ambient Temperature
A
T
Junction Temperature
J
f
Switching Frequency
SW
Thermal Information
Symbol
T
Storage Temperature
STG
T
Lead Soldering Temperature, 10 Seconds
L
θ
Thermal Resistance: Junction-to-Case
JC
θ
Thermal Resistance: Junction-to-Mounting Surface
J-PCB
P
Power Dissipation, T
D
Note:
1.
Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 26. Actual results
are dependent on mounting method and surface related to the design.
© 2009 Fairchild Semiconductor Corporation
FAN2106 • Rev. 1.1.0
Conditions
Conditions
VCC to AGND
VIN to PGND
FAN2106MPX
FAN2106EMPX
Parameter
P1 (Q2)
P2 (Q1)
P3
= 25°C
A
4
Min.
Max.
Unit
28
V
6
V
35
V
-0.3
6.0
V
-0.5
24.0
V
-5.0
30.0
-0.3
V
+0.3
V
CC
2.0
kV
2.5
Min.
Typ.
Max.
Unit
4.5
5.0
5.5
V
3
24
V
-10
+85
°C
-40
+85
+125
°C
200
600
KHz
Min.
Typ.
Max.
Unit
-65
+150
°C
+300
°C
4
°C/W
7
4
(1)
35
°C/W
(1)
2.8
W
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