LPC2470FBD208,551 NXP Semiconductors, LPC2470FBD208,551 Datasheet - Page 660
![IC ARM7 MCU LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2470FBD208,551
Manufacturer Part Number
LPC2470FBD208,551
Description
IC ARM7 MCU LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FBD208,551
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4361-5
935284068551
LPC2470FBD208-S
935284068551
LPC2470FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
- Current page: 660 of 792
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NXP Semiconductors
8. Battery RAM
9. RTC external 32 kHz oscillator component selection
UM10237_4
User manual
power consumption by using the signal from RTCX1-2 pins, and writing a 0 into the
PCRTC bit in the PCONP power control register (see
page
Remark: Note that if the RTC is running from the 32 kHz signal and powered by VBAT, the
internal registers can be read. However, they cannot be written to unless the PCRTC bit in
the PCONP register is set to 1, see
The Battery RAM is a 2 kbyte static RAM residing on the APB bus. The address range is
0xE008 4000 to 0xE008 47FF.The SRAM can be accessed word-wise (32-bit) only.
The Battery RAM is powered from the VBAT pin along with the RTC, both of which exist in
a power domain that is isolated from the rest of the chip. This allows them to operate while
the main chip power has been removed.
The RTC external oscillator circuit is shown in
resistance is integrated on chip, only a crystal, the capacitances C
connected externally to the microcontroller.
Table 26–583
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
C
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in
Table 26–583
C
C
Fig 136. RTC 32 kHz crystal oscillator circuit
L
X2
L
. Parasitics from PCB and package are not taken into account.
influences oscillation frequency. When using a crystal that is manufactured for a
specified in this table are calculated from the internal parasitic capacitances and the
60).
gives the crystal parameters that should be used. C
that belong to a specific C
Rev. 04 — 26 August 2009
Chapter 26: LPC24XX Real-Time Clock (RTC) and battery RAM
C
X1
RTCX1
Table
L
LPC24xx
. The value of external capacitances C
4–63.
32 kHz
Xtal
Figure
RTCX2
26–136. Since the feedback
Section 4–3.4 “Power control” on
C
X2
L
X1
is the typical load
and C
UM10237
© NXP B.V. 2009. All rights reserved.
X2
need to be
X1
660 of 792
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