LPC2470FBD208,551 NXP Semiconductors, LPC2470FBD208,551 Datasheet - Page 79
![IC ARM7 MCU LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2470FBD208,551
Manufacturer Part Number
LPC2470FBD208,551
Description
IC ARM7 MCU LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FBD208,551
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4361-5
935284068551
LPC2470FBD208-S
935284068551
LPC2470FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
UM10237_4
User manual
10.3 EMC Configuration register (EMCConfig - 0xFFE0 8008)
10.4 Dynamic Memory Control register (EMCDynamicControl -
The EMCConfig register configures the operation of the memory controller. It is
recommended that this register is modified during system initialization, or when there are
no current or outstanding transactions. This can be ensured by waiting until the EMC is
idle, and then entering low-power, or disabled mode. This register is accessed with one
wait state.
Table 70.
0xFFE0 8020)
The EMCDynamicControl register controls dynamic memory operation. The control bits
can be altered during normal operation.
EMCDynamicControl register.
Table 71.
Bit
0
7:1
8
31:9 -
Bit
0
1
Symbol
-
Symbol
Dynamic
memory clock
enable (CE)
Dynamic
memory clock
control (CS)
Table 5–70
EMC Configuration register (EMCConfig - address 0xFFE0 8008) bit description
Dynamic Control register (EMCDynamicControl - address 0xFFE0 8020) bit
description
Rev. 04 — 26 August 2009
shows the bit assignments for the EMCConfig register.
Value Description
0
1
-
0
1
-
Value Description
0
1
0
1
Endian mode:
Little-endian mode (POR reset value).
Big-endian mode.
On power-on reset, the value of the endian bit is 0. All
data must be flushed in the EMC before switching
between little-endian and big-endian modes.
Reserved, user software should not write ones to reserved
bits. The value read from a reserved bit is not defined.
CCLK : CLKOUT[1:0] ratio:
1:1 (POR reset value)
1:2 (this option is not available on the LPC2400)
This bit must contain 0 for proper operation of the EMC.
Reserved, user software should not write ones to reserved
bits. The value read from a reserved bit is not defined.
Chapter 5: LPC24XX External Memory Controller (EMC)
Clock enable of idle devices are deasserted to save
power (POR reset value).
All clock enables are driven HIGH continuously.
CLKOUT stops when all SDRAMs are idle and during
self-refresh mode.
CLKOUT runs continuously (POR reset value).
When clock control is LOW the output clock CLKOUT is
stopped when there are no SDRAM transactions. The
clock is also stopped during self-refresh mode.
Table 5–71
shows the bit assignments for the
UM10237
© NXP B.V. 2009. All rights reserved.
[1]
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Reset
Value
0
NA
0
NA
Reset
Value
0
1
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