LPC2470FBD208,551 NXP Semiconductors, LPC2470FBD208,551 Datasheet - Page 7
![IC ARM7 MCU LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2470FBD208,551
Manufacturer Part Number
LPC2470FBD208,551
Description
IC ARM7 MCU LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FBD208,551
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208LQFP
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4361-5
935284068551
LPC2470FBD208-S
935284068551
LPC2470FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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- Download datasheet (5Mb)
NXP Semiconductors
Table 6.
Table 7.
Table 8.
Table 9.
UM10237_4
User manual
Type number
LPC2420FBD208
LPC2460FBD208
LPC2460FET208
Type number
LPC2468FBD208 LQFP208
LPC2468FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm SOT950-1
Type number
LPC2468FBD208
LPC2468FET208
Type number
LPC2470FBD208 LQFP208
LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 × 15 ×
LPC2420/60 ordering options
LPC2468 ordering information
LPC2468 ordering options
LPC2470 ordering information
5.3 LPC2468 ordering options
5.4 LPC2470 ordering options
Package
Name
Package
Name
Flash
(kB)
512
512
Flash
(kB)
N/A
N/A
N/A
64 16 16 2
64 16 16 2
64 -
64 16 16 2
64 16 16 2
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
Description
plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
0.7 mm
SRAM (kB)
SRAM (kB)
16 2
98 Full 32-bit
98 Full 32-bit
82 Full 32-bit
98 Full 32-bit
98 Full 32-bit
Rev. 04 — 26 August 2009
External
bus
External
bus
Ethernet
MII/
RMII
MII/
RMII
Ethernet
-
MII/RMII
MII/RMII
Chapter 1: LPC24XX Introductory information
USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
yes
yes
USB
OTG/
OHCI/
DEV
+ 4 kB
FIFO
yes
yes
yes
2
2
2
2
-
SD/
MMC
yes
yes
SD/
MMC
yes
yes
yes
GP
DMA
yes
yes
yes
GP
DMA
yes
yes
UM10237
© NXP B.V. 2009. All rights reserved.
8
8
8
8
8
1
1
1
1
1
Version
SOT459-1
Version
SOT459-1
SOT950-1
Temp
range
−40 °C to
+85 °C
−40 °C to
+85 °C
−40 °C to
+85 °C
Temp
range
−40 °C to
+85 °C
−40 °C to
+85 °C
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