LPC2388FBD144,551 NXP Semiconductors, LPC2388FBD144,551 Datasheet - Page 15

• Manufacturer Part Number: LPC2388FBD144,551
• Description: IC ARM7 MCU FLASH 512K 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2388FBD144,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 144-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 104
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2388, MCB2388U, MCB2388UME
• Development Tools By Supplier: OM11012
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM11012 - BOARD EVAL FOR LPC2388568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4323; 935285417551; LPC2388FBD144-S

NXP Semiconductors
Table 3.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Pad provides special analog functionality.
[11] Pad provides special analog functionality.
[12] Pad provides special analog functionality.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
7. Functional description
LPC2388_0
Preliminary data sheet
Symbol
V
n.c.
V
V
VREF
VBAT
DD(3V3)
DD(DCDC)(3V3)
DDA
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a DAC input,
digital section of the pad is disabled.
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
Open-drain 5 V tolerant digital I/O I
functionality. When power is switched off, this pin connected to the I
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
Pad provides special analog functionality.
Pad provides special analog functionality.
Pin description
7.1 Architectural overview
Pin
41, 62,
77, 102,
114,
138
21, 81,
98
18, 60,
121
14
17
27
[12]
[14]
[14]
[14]
The LPC2388 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external
memory, and the AMBA APB for connection to other on-chip peripheral functions. The
microcontroller permanently configures the ARM7TDMI-S processor for little-endian byte
order.
The LPC2388 implements two AHB buses in order to allow the Ethernet block to operate
without interference caused by other system activity. The primary AHB, referred to as
AHB1, includes the VIC, GPDMA controller, and EMC.
[11]
[13]
…continued
Type
I
I
I
I
I
I
2
C-bus 400 kHz specification compatible pad. It requires an external pull-up to provide output
Description
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
Leave these pins unconnected.
3.3 V DC-to-DC converter supply voltage: This is the power supply for the on-chip
DC-to-DC converter only.
analog 3.3 V pad supply voltage: This should be nominally the same voltage as
V
power the ADC and DAC.
ADC reference: This should be nominally the same voltage as V
be isolated to minimize noise and error. The level on this pin is used as a reference
for ADC and DAC.
RTC power supply: 3.3 V on this pin supplies the power to the RTC peripheral.
DD(3V3)
Rev. 00.01 — 23 October 2007
but should be isolated to minimize noise and error. This voltage is used to
2
C-bus is floating and does not disturb the I
Fast communication chip
2
LPC2388
© NXP B.V. 2007. All rights reserved.
C lines.
DD(3V3)
but should
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