LPC2388FBD144,551 NXP Semiconductors, LPC2388FBD144,551 Datasheet - Page 39

• Manufacturer Part Number: LPC2388FBD144,551
• Description: IC ARM7 MCU FLASH 512K 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2388FBD144,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 144-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 104
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2388, MCB2388U, MCB2388UME
• Development Tools By Supplier: OM11012
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM11012 - BOARD EVAL FOR LPC2388568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4323; 935285417551; LPC2388FBD144-S

NXP Semiconductors
9. Static characteristics
Table 5.
T
LPC2388_0
Preliminary data sheet
Symbol
V
V
V
V
V
Standard port pins, RESET, RTCK
I
I
I
I
V
V
V
V
V
V
V
I
I
I
I
I
I
IL
IH
OZ
latch
OH
OL
OHS
OLS
pd
pu
amb
DD(3V3)
DD(DCDC)(3V3)
DDA
i(VBAT)
i(VREF)
I
O
IH
IL
hys
OH
OL
=
−
40
°
Static characteristics
C to +85
Parameter
supply voltage (3.3 V)
DC-to-DC converter
supply voltage (3.3 V)
analog 3.3 V pad
supply voltage
input voltage on pin
VBAT
input voltage on pin
VREF
LOW-level input
current
HIGH-level input
current
OFF-state output
current
I/O latch-up current
input voltage
output voltage
HIGH-level input
voltage
LOW-level input
voltage
hysteresis voltage
HIGH-level output
voltage
LOW-level output
voltage
HIGH-level output
current
LOW-level output
current
HIGH-level
short-circuit output
current
LOW-level short-circuit
output current
pull-down current
pull-up current
°
C for commercial applications, unless otherwise specified.
Conditions
core and external rail
V
V
V
no pull-up/down
−(0.5V
(1.5V
T
pin configured to provide a
digital function
output active
I
I
V
V
V
V
V
V
V
OH
OL
j
I
I
O
OH
OL
OH
OL
I
I
DD(3V3)
< 125 °C
= 0 V; no pull-up
= V
= 5 V
= 0 V
= 0 V; V
= −4 mA
= −4 mA
= 0.4 V
= V
= V
= 0 V
DD(3V3)
Rev. 00.01 — 23 October 2007
DD(3V3)
DD(3V3)
DDA
DD(3V3)
< V
O
);
I
; no pull-down
) < V
< 5 V
= V
− 0.4 V
DD(3V3)
I
<
;
[3][4][5]
[2]
[6]
[6]
[6]
[6]
[7]
[7]
[8]
[8]
Min
3.0
3.0
3.0
2.0
2.5
-
-
-
-
0
0
2.0
-
-
V
0.4
-
−4
4
-
-
10
−15
0
DD(3V3)
−
Typ
3.3
3.3
3.3
3.3
3.3
-
-
-
-
-
-
-
-
0.4
-
-
-
-
-
-
50
−50
0
Fast communication chip
[1]
LPC2388
© NXP B.V. 2007. All rights reserved.
Max
3.6
3.6
3.6
3.6
V
3
3
3
100
5.5
V
-
0.8
-
-
0.4
-
-
−45
50
150
−85
0
DDA
DD(3V3)
39 of 57
Unit
V
V
V
V
V
μA
μA
μA
mA
V
V
V
V
V
V
V
mA
mA
mA
mA
μA
μA
μA