LPC2388FBD144,551 NXP Semiconductors, LPC2388FBD144,551 Datasheet - Page 45

• Manufacturer Part Number: LPC2388FBD144,551
• Description: IC ARM7 MCU FLASH 512K 144LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2300r

Specifications of LPC2388FBD144,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 144-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 104
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC23
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2388, MCB2388U, MCB2388UME
• Development Tools By Supplier: OM11012
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: OM11012 - BOARD EVAL FOR LPC2388568-3999 - BOARD EVAL FOR LPC23 ARM MCU622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4323; 935285417551; LPC2388FBD144-S

NXP Semiconductors
10. Dynamic characteristics
Table 7.
C
[1]
Table 8.
T
[1]
[2]
[3]
LPC2388_0
Preliminary data sheet
Symbol
t
t
t
V
t
t
t
t
t
t
Symbol
External clock
f
T
t
t
t
t
I
t
SSP interface
t
r
f
FRFM
FEOPT
FDEOP
JR1
JR2
EOPR1
EOPR2
osc
CHCX
CLCX
CLCH
CHCL
2
f(o)
su(SPI_MISO)
amb
L
cy(clk)
CRS
C-bus pins (P0[27] and P0[28])
= 50 pF; R
Characterized but not implemented as production test. Guaranteed by design.
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
Bus capacitance C
=
−
40
°
Dynamic characteristics of USB pins (full-speed)
Dynamic characteristics
C to +85
pu
= 1.5 k
Parameter
oscillator frequency
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
output fall time
SPI_MISO set-up time
Parameter
rise time
fall time
differential rise and fall time
matching
output signal crossover voltage
source SE0 interval of EOP
source jitter for differential transition
to SE0 transition
receiver jitter to next transition
receiver jitter for paired transitions
EOP width at receiver
EOP width at receiver
b
°
C for commercial applications; V
in pF, from 10 pF to 400 pF.
Ω
on D+ to V
DD(3V3)
,unless otherwise specified.
Rev. 00.01 — 23 October 2007
DD(3V3)
Conditions
V
T
measured in
SPI Master
mode; see
Figure 8
Conditions
10 % to 90 %
10 % to 90 %
see
see
10 % to 90 %
must reject as
EOP; see
Figure 7
must accept as
EOP; see
Figure 7
t
amb
IH
r
/ t
to V
Figure 7
Figure 7
f
= 25 °C;
over specified ranges.
IL
Min
1
42
T
T
-
-
20 + 0.1 × C
-
[1]
[1]
cy(clk)
cy(clk)
Min
8.5
7.7
-
1.3
160
−2
−18.5
−9
40
82
× 0.4
× 0.4
[1]
b
[3]
Fast communication chip
Typ
-
-
-
-
-
-
-
-
-
-
Typ
-
-
-
-
-
-
-
11
[2]
LPC2388
© NXP B.V. 2007. All rights reserved.
Max
13.8
13.7
109
2.0
175
+5
+18.5
+9
-
-
Max
24
1000
-
-
5
5
-
-
Unit
ns
ns
%
V
ns
ns
ns
ns
ns
ns
45 of 57
Unit
MHz
ns
ns
ns
ns
ns
ns
ns