MCHC912B32CFUE8 Freescale Semiconductor, MCHC912B32CFUE8 Datasheet - Page 332

• Manufacturer Part Number: MCHC912B32CFUE8
• Description: IC MCU 32K FLASH 8MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HC12r

Specifications of MCHC912B32CFUE8

• Core Processor: CPU12
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 63
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 768 x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Cpu Family: HC12
• Device Core Size: 16b
• Frequency (max): 8MHz
• Interface Type: SCI/SPI
• Total Internal Ram Size: 1KB
• # I/os (max): 63
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Package: 80PQFP
• Family Name: HC12
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 63
• Processor Series: HC912B
• Core: HC12
• Data Ram Size: 1 KB
• Maximum Clock Frequency: 8 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68EVB912B32E
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Mechanical Specifications
20.2 80-Pin Quad Flat Pack (Case 841B-02)
332
SEATING
PLANE
-C-
DATUM
PLANE
L
-H-
-A-
C
E
H
61
80
60
DETAIL C
1
G
0.20
0.05 A-B
0.20
W
M
M
X
H
C
A
S
K
L
A-B
A-B
DETAIL A
U
M68HC12B Family Data Sheet, Rev. 9.1
R
-D-
T
S
S
D
D
Q
S
S
M
M
20
41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
THE D DIMENSION AT MAXIMUM MATERIAL
40
21
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUM PLANE -H-.
SEATING PLANE -C-.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE. DIMENSIONS A AND B DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT
DATUM PLANE -H-.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT.
-B-
B
DETAIL C
-H-
0.10
DATUM
PLANE
V
0.20
J
SECTION B-B
VIEW ROTATED 90
DETAIL A
DIM
M
W
A
B
C
D
E
F
G
H
K
L
N
P
Q
R
S
T
U
V
X
M
J
B
B
Freescale Semiconductor
C
13.90
13.90
16.95
16.95
MILLIMETERS
MIN
2.15
0.22
2.00
0.22
0.13
0.65
0.13
0.13
0.13
0.35
12.35 REF
0.325 BSC
0.65 BSC
5
0
0
---
1.6 REF
D
A-B
F
°
°
°
14.10
14.10
17.45
17.45
MAX
2.45
0.38
2.40
0.33
0.25
0.23
0.95
0.17
0.30
0.45
10
S
7
---
---
°
°
°
-A-,-B-,-D-
D
N
P
S