S9S08DZ96F2MLF Freescale Semiconductor, S9S08DZ96F2MLF Datasheet - Page 421
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S9S08DZ96F2MLF
Manufacturer Part Number
S9S08DZ96F2MLF
Description
MCU 96K FLASH MASK AUTO 48-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08DV96CLF.pdf
(458 pages)
Specifications of S9S08DZ96F2MLF
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
39
Program Memory Size
96KB (96K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
48-LQFP
Processor Series
S08D
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
6 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
87
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
S9S08DZ96F2MLF
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
I/O
1
2
3
is neglected) is:
Freescale may eliminate a test insertion at a particular temperature from the production test flow once sufficient
data has been collected and is approved.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Junction to Ambient Natural Convection
Num
1
2
3
4
T
θ
P
P
P
JA
A
D
int
I/O
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
D
D
D
T
int
C
DD
+ P
× V
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
I/O
I/O
DD
Single-layer board
Four-layer board
<< P
, Watts — chip internal power
K = P
int
MC9S08DZ128 Series Data Sheet, Rev. 1
and can be neglected. An approximate relationship between P
Table A-3. Thermal Characteristics
D
P
Rating
T
× (T
D
2,3
J
2,3
= K ÷ (T
J
= T
A
) in °C can be obtained from:
+ 273°C) + θ
A
100-pin LQFP
100-pin LQFP
+ (P
64-pin LQFP
48-pin LQFP
64-pin LQFP
48-pin LQFP
J
D
+ 273°C)
× θ
JA
P
JA
M
V
1
)
× (P
Symbol
D
θ
θ
)
T
T
2
JA
JA
A
J
Appendix A Electrical Characteristics
–40 to 105
–40 to 125
–40 to 85
T
L
Value
135
61
67
75
48
49
52
to T
H
°C/W
°C/W
Unit
°C
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
and T
421
J
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