S9S08DZ96F2MLF Freescale Semiconductor, S9S08DZ96F2MLF Datasheet - Page 421

• Manufacturer Part Number: S9S08DZ96F2MLF
• Description: MCU 96K FLASH MASK AUTO 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of S9S08DZ96F2MLF

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 96KB (96K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 6K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 48-LQFP
• Processor Series: S08D
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 6 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 87
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08DZ60
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 24 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
I/O
1
2
3
is neglected) is:
Freescale may eliminate a test insertion at a particular temperature from the production test flow once sufficient
data has been collected and is approved.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Junction to Ambient Natural Convection
Num
1
2
3
4
T
θ
P
P
P
JA
A
D
int
I/O
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
D
D
D
T
int
C
DD
+ P
× V
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
I/O
I/O
DD
Single-layer board
Four-layer board
<< P
, Watts — chip internal power
K = P
int
MC9S08DZ128 Series Data Sheet, Rev. 1
and can be neglected. An approximate relationship between P
Table A-3. Thermal Characteristics
D
P
Rating
T
× (T
D
2,3
J
2,3
= K ÷ (T
J
= T
A
) in °C can be obtained from:
+ 273°C) + θ
A
100-pin LQFP
100-pin LQFP
+ (P
64-pin LQFP
48-pin LQFP
64-pin LQFP
48-pin LQFP
J
D
+ 273°C)
× θ
JA
P
JA
M
V
1
)
× (P
Symbol
D
θ
θ
)
T
T
2
JA
JA
A
J
Appendix A Electrical Characteristics
–40 to 105
–40 to 125
–40 to 85
T
L
Value
135
61
67
75
48
49
52
to T
H
°C/W
°C/W
Unit
°C
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
and T
421
J