DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 453
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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1. End of serial data transmission
2. TE bit = 0
3. CKE1 bit = 1
4. C/
5. CKE1 bit = 0
SCK/port
Data
TE
C/A
CKE1
CKE0
Figure 12.24 Operation when Switching from SCK Pin Function to Port Pin Function
Sample Procedure for Avoiding Low-Level Output: As this sample procedure temporarily
places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an
external circuit.
With DDR = 1, DR = 1, C/
settings in the order shown.
A
bit = 0 ... switchover to port output
Bit 6
(Example of Preventing Low-Level Output)
Bit 7
1. End of transmission
A
= 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following
2. TE = 0
3. CKE1 = 1
Section 12 Serial Communication Interface
Rev. 2.00 Sep 20, 2005 page 413 of 800
4. C/A = 0
High-level outputTE
REJ09B0260-0200
5. CKE1 = 0
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