DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 699
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Table A.4
Instruction Mnemonic
ADD
ADDS
ADDX
AND
ANDC
BAND
Bcc
ADD.B #xx:8, Rd
ADD.B Rs, Rd
ADD.W #xx:16, Rd
ADD.W Rs, Rd
ADD.L #xx:32, ERd
ADD.L ERs, ERd
ADDS #1/2/4, ERd
ADDX #xx:8, Rd
ADDX Rs, Rd
AND.B #xx:8, Rd
AND.B Rs, Rd
AND.W #xx:16, Rd
AND.W Rs, Rd
AND.L #xx:32, ERd
AND.L ERs, ERd
ANDC #xx:8, CCR
BAND #xx:3, Rd
BAND #xx:3, @ERd
BAND #xx:3, @aa:8
BRA d:8 (BT d:8)
BRN d:8 (BF d:8)
BHI d:8
BLS d:8
BCC d:8 (BHS d:8)
BCS d:8 (BLO d:8)
BNE d:8
BEQ d:8
BVC d:8
BVS d:8
BPL d:8
BMI d:8
BGE d:8
BLT d:8
BGT d:8
BLE d:8
Number of Cycles per Instruction
Instruction
Fetch
I
1
1
2
1
3
1
1
1
1
1
1
2
1
3
2
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Branch
Addr. Read
J
Rev. 2.00 Sep 20, 2005 page 659 of 800
Stack
Operation
K
Byte Data
Access
L
1
1
Appendix A Instruction Set
Word Data
Access
M
REJ09B0260-0200
Internal
Operation
N
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