DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 61
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 2 CPU
2.3
Address Space
Figure 2.2 shows a simple memory map for the H8/3024 Group. The H8/300H CPU can address a
linear address space with a maximum size of 64 kbytes in normal mode, and 16 Mbytes in
advanced mode. For further details see section 3.6, Memory Map in Each Operating Mode.
The 1-Mbyte operating modes use 20-bit addressing. The upper 4 bits of effective addresses are
ignored.
H'0000
H'00000
H'000000
H'FFFF
H'FFFFF
H'FFFFFF
a. 1-Mbyte mode
b. 16-Mbyte mode
Normal mode
Advanced mode
Figure 2.2 Memory Map
Rev. 2.00 Sep 20, 2005 page 21 of 800
REJ09B0260-0200
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