DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 70
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 70 of 843
- Download datasheet (5Mb)
Section 2 CPU
2.6.2
Table 2.2 indicates the instructions available in the H8/300H CPU.
Table 2.2
Note: B: Byte
Rev. 2.00 Sep 20, 2005 page 30 of 800
REJ09B0260-0200
Data
transfer
Arithmetic
operations
Logic
operations
Shift instructions
Bit manipulation
Branch
System
control
Block data transfer
Function
W: Word
L: Longword
Instructions and Addressing Modes
MOV
POP, PUSH
MOVFPE,
MOVTPE
ADD, CMP
SUB
ADDX, SUBX
ADDS, SUBS
INC, DEC
DAA, DAS
MULXU,
MULXS,
DIVXU,
DIVXS
NEG
EXTU, EXTS
AND, OR, XOR
NOT
Bcc, BSR
JMP, JSR
RTS
TRAPA
RTE
SLEEP
LDC
STC
ANDC, ORC,
XORC
NOP
Instruction
Instructions and Addressing Modes
BWL
BWL
WL
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B
B
B
BWL
BWL
BWL
BWL
BWL
BWL
BWL
BWL
BW
WL
—
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—
B
B
B
B
B
L
BWL
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W
W
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B
BWL
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W
W
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BWL
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W
W
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—
BWL
Addressing Modes
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W
W
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B
B
BWL
W
W
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BWL
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W
W
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WL
BW
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