DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 555
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 17 Flash Memory [H8/3026F-ZTAT Version]
17.8
Flash Memory Emulation in RAM
Making a setting in the RAM control register (RAMCR) enables part of RAM to be overlapped
onto the flash memory area so that data to be written to flash memory can be emulated in RAM in
real time. After the RAMCR setting has been made, accesses can be made from the flash memory
area or the RAM area overlapping flash memory. Emulation can be performed in user mode and
user program mode. Figure 17.13 shows an example of emulation of realtime flash memory
programming.
Start of emulation program
Set RAMCR
Write tuning data to overlap RAM
Execute application program
No
Tuning OK?
Yes
Clear RAMCR
Write to flash memory emulation block
End of emulation program
Figure 17.13 Flowchart of Flash Memory Emulation in RAM
Rev. 2.00 Sep 20, 2005 page 515 of 800
REJ09B0260-0200
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