DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 532
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 17 Flash Memory [H8/3026F-ZTAT Version]
17.4.4
The flash memory in the H8/3026F-ZTAT version is divided into three 64-kbyte blocks, one 32-
kbyte block, and eight 4-kbyte blocks. Erasing can be carried out in block units.
Rev. 2.00 Sep 20, 2005 page 492 of 800
REJ09B0260-0200
Block Configuration
Figure 17.4 Writing Overlap RAM Data in User Program Mode
Application program
Flash memory
Program data
Address H'3FFFF
Address H'00000
256 kbytes
4 kbytes
64 kbytes
64 kbytes
32 kbytes
64 kbytes
Programming control program
8
Execution state
(program data)
Overlap RAM
RAM
SCI
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