UPD70F3736GK-GAK-AX Renesas Electronics America, UPD70F3736GK-GAK-AX Datasheet - Page 623
UPD70F3736GK-GAK-AX
Manufacturer Part Number
UPD70F3736GK-GAK-AX
Description
MCU 32BIT V850ES/JX3-L 80-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet
1.UPD70F3736GK-GAK-AX.pdf
(830 pages)
Specifications of UPD70F3736GK-GAK-AX
Package / Case
*
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Speed
20MHz
Number Of I /o
66
Core Processor
RISC
Program Memory Type
FLASH
Ram Size
16K x 8
Program Memory Size
256KB (256K x 8)
Data Converters
A/D 8x10b, D/A 1x8b
Oscillator Type
Internal
Peripherals
DMA, LVD, PWM, WDT
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Core Size
32-Bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD70F3736GK-GAK-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Remarks 1. Transfer in the order of DMA0 → DMA1 → DMA0 (DMA2 is held pending.)
DMA2 transfer request
DMA0 transfer request
DMA1 transfer request
Mode of processing
System clock
DMA transfer
2. In the case of transfer between external memory spaces (multiplexed bus, no wait)
DF1 bit
DF2 bit
DF0 bit
CPU processing
Preparation
for transfer
Read
DMA0 processing
Idle
Write
Figure 18-2. Priority of DMA (2)
processing
End
CPU processing
Preparation
for transfer
Read
DMA1 processing
Idle
Write
processing
End
CPU processing
Preparation
for transfer
processing
Read
DMA0
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