MC68HC908EY16CFA Freescale Semiconductor, MC68HC908EY16CFA Datasheet - Page 271

• Manufacturer Part Number: MC68HC908EY16CFA
• Description: IC MCU 16K FLASH 8MHZ SPI 32LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC68HC908EY16CFA

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LIN, SCI, SPI
• Peripherals: POR, PWM
• Number Of I /o: 24
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-LQFP
• Processor Series: HC08EY
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: ESCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 24
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, M68CBL05CE, ZK-HC08EY-A
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No

Changes from Rev 6.0 published in January 2004 to Rev 7.0 published in March 2004
Changes from Rev 5.0 published in September 2003 to Rev 6.0 published in January 2004
Freescale Semiconductor
Electrical Specifications
Electrical Specifications
Electrical Specifications
Properly (COP) Module
Input/Output (I/O) Ports
Development Support
Ordering Information
Computer Operating
General Description
Timer Interface A
MC68HC908EY8
MC68HC908EY8
MC68HC908EY8
Converter (ADC)
Communications
Analog-to-Digital
Enhanced Serial
Generator (ICG)
Generator (ICG)
Interface (ESCI)
and Mechanical
(TIMA) Module
Specifications
Internal Clock
Internal Clock
Appendix A.
Appendix A.
Appendix A.
(PORTS)
Memory
Memory
Memory
Section
Section
Module
Module
Module
Module
Page (in Rev 7.0)
Page (in Rev 6.0)
298, 299
265 on
284 on
MC68HC908EY16 • MC68HC908EY8 Data Sheet, Rev. 10
116
141
177
244
286
288
295
297
295
19
35
37
50
72
89
40
Changed “25 percent accuracy with trim capability to 2 percent” to “25
percent accuracy with a trimming capability of better than 1 percent” (two
instances).
Changed “BRKSCR” to “BSCR”.
Added sentence about 125°C to 135°C temperature range.
Changed “ms” to “µs” (two instances).
Changed “COPRS = 1” to “COPRS = 0”.
Changed “7 percent” to “3.5 percent” (two instances).
Replaced “to +/-2%” with a cross-reference.
Added note.
Modified note to include reference to Prescaler Divisor Fine Adjust (PDFA).
Deleted “port B or”.
Whole section on Development Support replaced.
Changed “125°C” to “135°C” on pages 282, 283 (3), 285 (2), 286 (2).
Added note 6 on page 291.
Modified the first row of the table to show two crystal options, instead of one..
Modified the typical and maximum values in the first row of the table.
Appended row to Table 21-1.
Appended row to Table A-1.
Change RAM size from 512 to 384 and adjusted addresses accordingly.
Removed erroneous Caution note to 2.6.3 FLASH Mass Erase Operation
Updated 2.6.5 FLASH Block Protection and 2.6.6 FLASH Block Protect
Register
Added appendix describing the MC68HC908EY8
Description of change
Description of change
271