LFXP3C-3TN144I Lattice, LFXP3C-3TN144I Datasheet - Page 385
LFXP3C-3TN144I
Manufacturer Part Number
LFXP3C-3TN144I
Description
FPGA - Field Programmable Gate Array 3.1K LUTs 100 I/O 1.8/2.5/3.3V IND
Manufacturer
Lattice
Specifications of LFXP3C-3TN144I
Number Of Programmable I/os
100
Data Ram Size
55296
Supply Voltage (max)
3.465 V
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.71 V
Package / Case
TQFP-144
Package
144TQFP
Family Name
LatticeXP
Device Logic Units
3000
Maximum Internal Frequency
320 MHz
Typical Operating Supply Voltage
1.8|2.5|3.3 V
Maximum Number Of User I/os
100
Ram Bits
55296
Re-programmability Support
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP3C-3TN144I
Manufacturer:
INTEL
Quantity:
1 143
Company:
Part Number:
LFXP3C-3TN144I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Lattice Semiconductor
144-ball csBGA BGA Breakout Examples
These examples place an ispMACH 4000ZE in a 7x7 mm, 0.5 mm pitch, 144-ball csBGA package (LC4256ZE-
MN144) into two fabrication scenarios. One for a 6-layer stack up with maximum I/O utilization and a 4-layer with
about 5% fewer I/Os. The 6-layer (Example #1) design avoids uses of micro vias and takes advantage of removed
pads on inner layers to route all pins out to 6 layers with good layer structure for high-speed signal integrity.
Figure 14-8. CAM Artwork Screen Shots, Example #1, 144-ball csBGA
Layer 1 Primary
Layer 3 Signal
Layer 5 Power
14-10
Layer 6 Secondary
PCB Layout Recommendations
Layer 4 Signal
Layer 2 GND
for BGA Packages
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