LFXP3C-3TN144I Lattice, LFXP3C-3TN144I Datasheet - Page 391
LFXP3C-3TN144I
Manufacturer Part Number
LFXP3C-3TN144I
Description
FPGA - Field Programmable Gate Array 3.1K LUTs 100 I/O 1.8/2.5/3.3V IND
Manufacturer
Lattice
Specifications of LFXP3C-3TN144I
Number Of Programmable I/os
100
Data Ram Size
55296
Supply Voltage (max)
3.465 V
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.71 V
Package / Case
TQFP-144
Package
144TQFP
Family Name
LatticeXP
Device Logic Units
3000
Maximum Internal Frequency
320 MHz
Typical Operating Supply Voltage
1.8|2.5|3.3 V
Maximum Number Of User I/os
100
Ram Bits
55296
Re-programmability Support
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP3C-3TN144I
Manufacturer:
INTEL
Quantity:
1 143
Company:
Part Number:
LFXP3C-3TN144I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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PCB Layout Recommendations
Lattice Semiconductor
for BGA Packages
pogo pin type probes are extremely small and can handle GHz range DC frequency. Zero ohm resistors are also
commonly used in first-run boards as a way to gain access to a pad or pin.
After assembly, BGA solder point quality and integrity is visually inspected with X-ray technology as part of the fab-
rication process. A special X-ray machine can look through the plastic package, substrate and silicon to directly
view the BGA solder balls, vias, traces and pads.
Figure 14-15. Example of How Defects May Appear in an X-Ray Image
The X-ray image in Figure 14-16 shows proper alignment; no voids or defects are noted. Balls, vias and traces are
visible.
Figure 14-16. X-Ray Inspection Plot of ispMACH 4000ZE 144-ball csBGA
(Photo Courtesy of CEM, Ltd., www.cemltd.com)
14-16
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