LFXP3C-3TN144I Lattice, LFXP3C-3TN144I Datasheet - Page 394

• Manufacturer Part Number: LFXP3C-3TN144I
• Description: FPGA - Field Programmable Gate Array 3.1K LUTs 100 I/O 1.8/2.5/3.3V IND
• Manufacturer: Lattice

Specifications of LFXP3C-3TN144I

• Number Of Programmable I/os: 100
• Data Ram Size: 55296
• Supply Voltage (max): 3.465 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.71 V
• Package / Case: TQFP-144
• Package: 144TQFP
• Family Name: LatticeXP
• Device Logic Units: 3000
• Maximum Internal Frequency: 320 MHz
• Typical Operating Supply Voltage: 1.8|2.5|3.3 V
• Maximum Number Of User I/os: 100
• Ram Bits: 55296
• Re-programmability Support: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
Revision History
September 2006
September 2010
November 2005
February 2010
January 2005
August 2010
March 2008
March 2010
June 2006
May 2009
Date
Version
01.0
01.1
01.2
01.3
01.4
01.5
01.6
01.7
01.8
01.9
Initial release.
Figures updated.
Removed NSMD content.
Added note to BGA Board Layout Recommendations table.
Reformatted BGA Package Types section in tabular format.
Revised recommended Solder Mask Defined and Non Solder Mask
Defined PCB solder pad dimensions to match industry standards.
Updated BGA Board Layout Recommendations table and BGA Pack-
age Types table for 0.4 mm pitch ucBGA package.
Edits to most sections and additional links and graphics added for each
example.
Replaced Lattice BGA Naming Conventions table with Lattice Semicon-
ductor BGA Package Types table and SMD/NSMD Pad Recommenda-
tions table.
Lattice Semiconductor SMD/NSMD Pad Recommendations table:
Specified nominal Solder Mask Opening for each Lattice BGA package,
clarified recommended Solder Mask Opening and Solder Pad Diame-
ters and added cautionary note.
Lattice Semiconductor SMD/NSMD Pad Recommendations table -
Added 64 csBGA to 0.5mm pitch column.
14-19
Change Summary
PCB Layout Recommendations
for BGA Packages