PIC16LF1828-E/ML Microchip Technology, PIC16LF1828-E/ML Datasheet - Page 352

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PIC16LF1828-E/ML

Manufacturer Part Number
PIC16LF1828-E/ML
Description
7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 18 I/0, Enhanced Mid Range Core, Nan
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheet

Specifications of PIC16LF1828-E/ML

Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
20-VFQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
30.0
Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current out of V
Maximum current into V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Note 1:
 2010 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
DD
DD
with respect to V
with respect to V
K
(V
PIN
(1)
DD
DD
< 0 or V
............................................................................................................................... 800 mW
SS
SS
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
PIN
SS
SS
, PIC16F1824/1828 .................................................................... -0.3V to +6.5V
, PIC16LF1824/1828 .................................................................. -0.3V to +4.0V
> V
(†)
DD
A
A
SS
)20 mA
A
A
 +85°C for industrial.................................................................. 800 mA
 +125°C for extended ................................................................. 30 mA
 +85°C for industrial................................................................. 85 mA
 +125°C for extended .............................................................. 35 mA
........................................................................... -0.3V to (V
Preliminary
DIS
= V
DD
x {I
PIC16(L)F1824/1828
DD
–  I
OH
} +  {(V
DD
– V
OH
) x I
DS41419B-page 351
OH
} + (V
DD
+ 0.3V)
O
l x I
OL
).

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